With regard to digital integrated circuits, process technology refers to the particular method used to make silicon chips. The driving force behind the manufacture of integrated circuits is miniaturization, and process technology boils down to the size of the finished transistor and other components. The smaller the transistors, the more transistors in the same area, the faster they switch, the less energy they require and the cooler the chip runs (given equal numbers of transistors).
Measured in Nanometers
The size of the features (the elements that make up the structures on a chip) used to be measured in micrometers. A 3 µm process technology, also called a "technology node" and "process node," referred to a silicon chip with features three micrometers in size. Today, features are measured in nanometers. A 45 nm process technology refers to features 45 nm or 0.45 µm in size.
Elements Measured
Historically, the process technology referred to the length of the silicon channel between the source and drain terminals in field effect transistors (see FET). The sizes of other features are generally derived as a ratio of the channel length, where some may be larger than the channel size and some smaller. For example, in a 90 nm process, the length of the channel may be 90 nm, but the width of the gate terminal may be only 50 nm.
An Example of Progress
Consider that the process technology of the first 486 chip in 1989 was one micron (1,000 nanometers). By 2003, the state-of-the-art decreased to 90 nm ("90 nano"). In 15 years, feature sizes were reduced by slightly less than one millionth of a meter. What may seem like a minuscule, microscopic change to the casual observer took thousands of man years and billions of dollars worth of research and development. Note the huge variance in semiconductor feature sizes starting in the 1950s (see chart below).
Chips Are Nanotechnology
Intel introduced 45 nm processors in 2008. To understand how tiny 45 nanometers is, it would take two thousand 45 nm objects laid side-by-side to equal the thickness of one human hair.
In 2010, 32 nm chips were introduced, and feature sizes as low as 11 nm are expected in the future. For some time, chips have been in the realm of nanotechnology, which refers to elements 100 nanometers and smaller. See half-node.
Semiconductor Feature Sizes
(approximate for all vendors)
Nanometers Micrometers
Year (nm) (µm)
1957 120,000 120.0
1963 30,000 30.0
1971 10,000 10.0
1974 6,000 6.0
1976 3,000 3.0
1982 1,500 1.5
1985 1,300 1.3
1989 1,000 1.0
1993 600 0.6
1996 350 0.35
1998 250 0.25
1999 180 0.18
2001 130 0.13
2003 90 0.09
2005 65 0.065
2008 45 0.045
2010 32 0.032
2012 22 0.022**
2014 16 0.016**
2020 11 0.011**
** estimated
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| Semiconductor manufacturing processes |
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Half-nodes |
The 180 nm process refers to the level of semiconductor process technology that was reached in the 1999–2000 timeframe, by most leading semiconductor companies, like Intel, Texas Instruments, IBM, and TSMC.
The origin of the 180 nm value is historical, as it reflects a trend of 70% scaling every 2–3 years. The naming is formally determined by the International Technology Roadmap for Semiconductors (ITRS).
Some of the first CPUs manufactured with this process include Intel Coppermine family of Pentium III processors. This was the first technology using a gate length shorter than that of light used for lithography (which has a minimum of 193 nm).
Some more recent microprocessors and microcontrollers (e.g. PIC) are using this technology because it is typically low cost and does not require upgrading of existing equipment.
| Preceded by 250 nm |
CMOS manufacturing processes | Succeeded by 130 nm |
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