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Chip carrier

 
Computer Desktop Encyclopedia: chip carrier
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(1) The package that a chip is mounted in. See chip package.

(2) A chip package with connectors on all sides. See leaded chip carrier and leadless chip carrier.

The Chip Package
All chips are packaged in a housing with pins that plug into or are soldered onto a printed circuit board. This is a picture of a Motorola 6801 microcontroller. It is packaged in a DIP chip which has been widely used for memory and small microprocessors.

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Wikipedia: Chip carrier
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A standard-sized 8-pin dual in-line package (DIP) containing a 555 timer IC.
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A chip carrier, also known as a chip container or chip package, is a container for a transistor or an integrated circuit. The carrier usually provides metal leads, or "pins", which are sturdy enough to electrically and mechanically connect the fragile silicon microchip to a circuit board. This connection may be made by soldering or by mechanical force applied by springs or a ZIF socket. Most circuit boards today mount the chips on the surface of the board, although previously it was common to place the pins in through-holes punched into the board. As smaller packages are cheaper and ecologically safer, most modern chip carriers are too small for practical installation by humans. Modern microprocessors may have over 1000 pins, so the integrated circuit packaging technology to manufacture and install the carrier must be very reliable.

Contents

Types of chip carriers

  • BCC: Bump Chip Carrier [1]
  • BGA: Ball Grid Array (also CBGA, PBGA, FBGA, UFBGA, UBGA, MBGA) [2] [3] [1]
  • BQFP: Bumpered Quad Flat Pack [1]
  • CBGA: Ceramic Ball Grid Array [1]
  • CCGA: ceramic column grid array (CGA) [4] [1]
  • CDIP: Ceramic DIP [3]
  • CERDIP: glass sealed ceramic DIP [3]
  • CERPACK: ceramic package [5]
  • CFP: Ceramic Flat Pack [1]
  • CGA: column grid array [4] [1]
  • CLCC: Ceramic Leadless Chip Carrier [3]
  • COB: chip-on-board; a bare silicon chip, that is usually an integrated circuit, is supplied without a package. [4]
  • COF: chip-on-flex; a variation of COB, where a chip is mounted directly to a flex circuit. [4]
  • COG: chip-on-glass; a variation of COB, where a chip is mounted directly to a piece of glass - typically an LCD. [4]
  • CPGA: Ceramic Pin Grid Array [6] [1]
  • CQFP: ceramic quad flat-pack, similar to PQFP [3] [1]
  • CQGP: [7]
  • CSOP: ceramic SOP [8]
  • CSP: Chip Scale Package (package no more than 1.2x the size of the silicon chip) [9] [10]
  • DIL: Dual Inline Package (synonym for DIP) [11]
  • DIP: Dual Inline Package (.1" pin spacing, rows .3" or .5" apart) [11]
  • DFN: Dual Flat Pack, No Lead [1]
  • DLCC: Dual Lead-Less Chip Carrier (Ceramic) [1]
  • ETQFP: Extra Thin Quad Flat Package [1]
  • FBGA: fine pitch ball grid array, with a square or rectangular array of solder balls on one surface [1]
  • FCPGA: Flip-chip Pin Grid Array [1]
  • LBGA : Low Profile Ball Grid Array (see BGA) (also Laminate Ball Grid Array) [1]
  • LCC: Leadless Chip Carrier, contacts are recessed vertically. [4] [1]
  • LCC: Leaded Chip Carrier [1]
  • LCCC: Leaded Ceramic Chip Carrier [1]
  • LLP: Lead Less lead frame Package, a package with metric pin distribution (0.5 mm - 0.8 mm pitch) [12]
  • LFBGA - low profile fine pitch ball grid array [1]
  • LGA: Land Grid Array [1]
  • LQFP: Low-profile Quad Flat Package [1]
  • LTCC: Low temperature co-fired ceramic [13]
  • MCM: Multi-Chip Module [14]
  • MDIP: Mini-DIP (see DIP) [15]
  • MELF: Metal Electrode Leadless Face (usually for resistors and diodes) [4]
  • MICRO SMD: a chip-size package (CSP) developed by National Semiconductor [16]
  • MICRO SMDXT: micro Surface Mount Device extended technology [17]
  • MICROARRAY: Usually refers to a chip for testing DNA [18] [19]
  • MLF Micro Lead Frame (also called QFN) [20]
  • MLP: Micro Leadframe Package with a 0.5 mm contact pitch, no leads [1]
  • MQFP - Metric Quad Flat Pack, a QFP package with metric pin distribution [1]
  • MSOP
  • OBGA: Organic Ball Grid Array [1]
  • OPGA: Organic Pin Grid Array
  • PBGA: Plastic Ball Grid Array [1]
  • PDIP: Plastic DIP [3]
  • PGA: Pin Grid Array (also known as PPGA) [3]
  • PLCC: Plastic Leaded Chip Carrier [3] [1]
  • PQFN: power quad flat-pack, no-leads, with exposed die-pad[s] for heatsinking [21]
  • PQFP: Plastic Quad Flat Pack QFP [3] [1]
  • PSOP: Plastic small-outline package [1]
  • QFN: Quad Flat No Leads, also called micro lead frame (MLF). [1]
  • QFP: Quad Flat Package [3] [1]
  • QIP: Quad Inline Package [3]
  • QSOP: Quarter-Size Small-Outline package, with pin spacing of 0.635 mm. [4] [1]
  • SBGA: Super BGA - above 500 Pin count [1]
  • SDIP: Skinny DIP (standard DIP with .1" pin spacing, rows .3" apart) [3]
  • SDIP: Shrink DIP (smaller pin spacing than regular DIP) [3]
  • SIDEBRAZE: [22] [23]
  • SOD: Small Outline Diode. [4]
  • SOIC: Small Outline Integrated Circuit (Also SOIC NARROW and SOIC WIDE).
  • SOP: Small Outline Package (also PSOP, TSOP, SSOP, TSSOP) [3]
  • SOT: Small Outline Transistor (also SOT-23, SOT-223, SOT-323). [4]
  • SSOP: Shrink Small-Outline Package [1]
  • SIP: Single in-line package
  • SOIC: Small-outline Integrated Circuit
  • TBGA: Thin Ball Grid Array [1]
  • TCSP: True Chip Size Package (package is same size as silicon) [24]
  • TDSP: True Die Size Package (same as TCSP) [24]h
  • TEPBGA: Thermally Enhanced Plastic BGA.
  • TFBGA - thin fine pitch BGA. [4] [1]
  • TO-XX: wide range of small pin count packages often used for discrete parts like transistors or diodes.
    • TO-3
    • TO-5
    • TO-18: metal can package with radial leads
    • TO-39
    • TO-46
    • TO-92: plastic encapsulated package with three leads
    • TO-99
    • TO-100
    • TO-220: plastic package with a (usually) metal heat sink tab and three leads
    • TO-252
    • TO-263
    • TO-263 THIN:
  • TQFP: Thin Quad Flat Pack [3] [1]
  • TSOP: Thin Small-outline Package [1]
  • TSSOP: Thin Shrink Small Outline Package [1]
  • TVSOP: Thin Very Small-Outline Package [1]
  • UCSP: Similar to a BGA (A Maxim trademark example) [10]
  • μBGA - micro-BGA (Ball grid array), with ball spacing less than 1 mm
  • μMAX: Similar to a SOIC. (A Maxim trademark example)
  • UFBGA: Ultra Fine BGA [4] [1]
  • VQFB: Very-thin Quad Flat Pack [1]
  • WSON: Very Very Thin Small Outline No Lead Package
  • ZIP: Zig-zag in-line package

See also

External links

References

  1. ^ a b c d e f g h i j k l m n o p q r s t u v w x y z aa ab ac ad ae af ag ah ai aj ak al am an ao http://www.interfacebus.com/Design_Pack_Type_SOIC.html
  2. ^ Ball grid array
  3. ^ a b c d e f g h i j k l m n o http://www.cpushack.net/Packages.html
  4. ^ a b c d e f g h i j k l SMT
  5. ^ http://www.national.com/packaging/parts/CERPACK.html
  6. ^ CPGA
  7. ^ http://www.national.com/packaging/parts/CQGP.html
  8. ^ http://howto.wikia.com/wiki/Howto_identify_chip_packages/Small_outline_package
  9. ^ http://www.siliconfareast.com/csp.htm
  10. ^ a b http://www.maxim-ic.com/appnotes.cfm/an_pk/4002
  11. ^ a b Dual in-line package
  12. ^ http://www.national.com/analog/packaging/llp
  13. ^ http://www.minicaps.com/ltcc.html
  14. ^ http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=410760
  15. ^ http://www.national.com/packaging/folders/n08e.html
  16. ^ http://www.national.com/analog/packaging/appnote_msmd
  17. ^ http://www.national.com/news/item/0,1735,1116,00.html
  18. ^ DNA_microarray
  19. ^ http://opa.yale.edu/news/article.aspx?id=4538
  20. ^ http://www.eetasia.com/ART_8800353559_480100_NP_9b8d1426.HTM
  21. ^ http://www.motorola.com/mediacenter/news/detail.jsp?globalObjectId=2791_2269_23
  22. ^ http://www.chelseatech.com/packages.htm
  23. ^ http://cpu.linuxmania.net/liste/cpuinfo/chip-package/SIDEBRAZE_DIP/chip-package-sidebraze.htm
  24. ^ a b http://www.chipscalereview.com/issues/ES/issues/0301/packagingFoundries.html


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