| Dichlorosilane | |
|---|---|
 |
|
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| IUPAC name |
Dichlorosilane
|
| Other names | DCS |
| Identifiers | |
| CAS number | 4109-96-0  |
| PubChem | 61330 |
| UN number | 2189 |
| RTECS number | VV3050000 |
| SMILES |
ClSiCl
|
| Properties | |
| Molecular formula | H2Cl2Si |
| Molar mass | 101.01 g·mol-1 |
| Appearance | Colorless gas with characteristic odor |
| Melting point |
−122 °C |
| Boiling point |
8 °C |
| Solubility in water | Reacts |
| Vapor pressure | 163.6 kPa (20 °C) |
| Hazards | |
| MSDS | ICSC 0442 |
| EU Index | Not listed |
| Main hazards | Extremely flammable gas, explosive in air |
| NFPA 704 |
 4
4
2
|
| Flash point | −28 °C |
| Explosive limits | 4.1–99% |
| Related compounds | |
| Related chlorosilanes | Chlorosilane Trichlorosilane Silicon tetrachloride |
| Related compounds | Difluorosilane Dibromosilane Dichloromethane |
| (what is this?) (verify) Except where noted otherwise, data are given for materials in their standard state (at 25 °C, 100 kPa) |
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| Infobox references | |
Dichlorosilane (H2SiCl2), or DCS as it is commonly known, is usually mixed with ammonia (NH3) in LPCVD chambers to grow silicon nitride in semiconductor processing.
A higher concentration of DCS:NH3 (ie 16:1), usually results in lower stress nitride films.
External links
- Safety data for dichlorosilane from the Chemistry Department at Oxford University.
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