Die

A medium-scale integrated circuit die, with bond wires attached.

A VLSI integrated-circuit die

A die in the context of integrated circuits is a small block of semiconducting material, on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) through processes such as photolithography. The wafer is cut (“diced”) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die.

There are three commonly used plural forms: dice, dies, and die.^[1][2]

See also

Electronics portal

• Integrated circuit
• Semiconductor fabrication
• Wafer dicing
• Die preparation

References

1. ^ John E. Ayers (2004). Digital Integrated Circuits. CRC Press. ISBN 084931951X. http://books.google.com/books?id=QHtalNXHKbsC&pg=PA31&dq=die+dice+dies+plural+wafer&lr=&as_brr=3&ei=hakESZTiJJGssgO9yNGqBA. 
2. ^ Robert Allen Meyers (2000). Encyclopedia of Physical Science and Technology. Academic Press. ISBN 0122269306. http://books.google.com/books?id=C4gyAAAAMAAJ&q=chips+dies+plural+wafer&dq=chips+dies+plural+wafer&lr=&as_brr=0&ei=T7EESY_gDIPytQPkq8SzDA&pgis=1. 

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