Micro-FCBGA (Flip Chip Ball Grid Array) is Intel's current BGA mounting method for mobile processors that use a flip chip binding technology. It was introduced with the Coppermine Mobile Celeron and replaces the older BGA2 ball-grid-array mounting method used in the Coppermine Pentium III mobile CPUs. Micro-FCBGA has 479 balls that are 0.78 mm in diameter and arranged similarly to the pins in a pin grid array. The processor is affixed to the motherboard by soldering the balls to the motherboard. This allows for a much thinner CPU/interface profile than a pin grid array socket arrangement, but the micro-FCBGA chip is not removable from the motherboard. Micro-FCBGA is commonly used to mount ultra-low-voltage and low-voltage versions of mobile CPUs to the motherboard, likely due to its much thinner profile fitting better in the very thin sub-notebooks that those CPUs are usually used in. However, standard-voltage versions of the CPUs also occasionally use a micro-FCBGA interface instead of a pin grid array socket.
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