| Name | PCB size (mm) |
|---|---|
| WTX | 356 × 425 |
| AT | 350 × 305 |
| Baby-AT | 330 × 216 |
| BTX | 325 × 266 |
| ATX | 305 × 244 |
| EATX (Extended) | 305 × 330 |
| LPX | 330 × 229 |
| microBTX | 264 × 267 |
| NLX | 254 × 228 |
| Ultra ATX | 244 × 367 |
| microATX | 244 × 244 |
| DTX | 244 × 203 |
| FlexATX | 229 × 191 |
| Mini-DTX | 203 × 170 |
| EBX | 203 × 146 |
| microATX (min.) | 171 × 171 |
| Mini-ITX | 170 × 170 |
| EPIC (Express) | 165 × 115 |
| Mini ATX | 150 × 150 |
| ESM | 149 × 71 |
| Nano-ITX | 120 × 120 |
| COM Express | 125 × 95 |
| ESMexpress | 125 × 95 |
| ETX/XTX | 114 × 95 |
| Pico-ITX | 100 × 72 |
| PC/104 (-Plus) | 96 × 90 |
| ESMini | 95 × 55 |
| Qseven | 70 × 70 |
| mobile-ITX | 60 × 60 |
| CoreExpress | 58 × 65 |
Mobile-ITX is the smallest (by 2009) x86 compliant motherboard form factor presented by VIA Technologies in December, 2009. The motherboard size (CPU module) is 60mm × 60mm[1]. There are no computer ports on the CPU module and it is necessary to use an I/O carrier board. The design is intended for medical, transportation and military embedded markets. The first commercial Mobile-ITX CPU module is expected in Q1 of 2010.
The Mobile-ITX form factor was announced by VIA Technologies at Computex in June, 2007. The motherboard size of first prototypes was 75mm by 45mm[2]. The design was intended for ultra-mobile computing such as a smartphone or UMPC.
The prototype boards shown to date include a x86-compliant 1 GHz VIA C7-M processor, 256 or 512 megabytes of RAM, a modified version of the VIA CX700 chipset (called the CX700S),[3] an interface for a cellular radio module (demonstration boards contain a CDMA radio), a DC-DC electrical converter, and various connecting interfaces.
At the announcement, an ultra-mobile PC reference design was shown running Windows XP Embedded.[4]
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