A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors.
MISD is used in systolic array.
these array are used for wifi applications
Used to replace a failed drive in a redundant array.
Take another array big enough to hold both array copy content of these two array into new one. You merged two array and haven't used a single function.!
All arrays are one-dimensional. A two-dimensional array is simply a one-dimensional array of one-dimensional arrays: int a[2][3]; This is an array of 2 elements where each element is itself an array of 3 integers. In other words it is an array of 6 integers. The two dimensions simply allow us to split the array into two sub-arrays of 3 elements each.
ball grid array
Socket F
The Lenovo b575 is a ball grid array CPU and cannot be upgraded to a higher one. Only a pin grid array CPU can be upgraded to a higher processor.
This refers to the replacement of the BGA (Ball Grid Array) on devices such as the X-Box 360.
Land grid array and Pin grid array
The grid method is a way of teaching multiplication that is used in primary schools. Pupils move on from an array to the grid method. It is also used for teaching times tables.
Socket F
One has pin in front, one has land
Earlier Pentiums used a pin grid array ( PGA ) socket, with pins aligned in uniform rows around the socket. Later sockets use a staggered pin grid array ( SPGA ), with pins staggered over the socket to squeeze more pins into a small space.
Reballing a ball grid array circuitboard is a delicate operation. Typically, a hot air gun is used to melt the existing solder and the individual components are carefully removed. Any damaged or defective components are repaired or replaced and the old solder is cleaned off. For a ball grid array, new solder balls are then placed into the proper configuration for the board, and the components carefully soldered into place.
PGA Pin Grid Array is the socket that holds the CPU, there is also the LGA/ land grid array
A Ball Grid Array is a form of surface mount technology or SMT package that is being used increasingly for integrated circuits. BGA offers many advantages and as a result, it is being used increasingly in the manufacture of electronic circuits.