The invention of the planar process by which most IC devices are fabricated relies on the gas phase diffusion of dopants to produce N-type and P-type regions, but also on the ability of silicon dioxide to mask these diffusion processes and passivate the chip surface eliminating the need for hermetic packaging. Silicon is unique in its ability to be oxidized to produce a stable insulating coating.
Germanium dioxide is crumbly and water soluble, making it impossible to use in this process. While the first IC made used germanium, it had to be handwired which would have made them prohibitively expensive to produce and much larger than even the early silicon ICs.
Germanium cannot be used in any integrated circuit as its oxide is crumbly and water soluble (unlike silicon's oxide which is hard and stable). The only germanium integrated circuits ever made were very low density and the interconnects between components on the chip had to be done by hand under a microscope. There has been work done on integrated circuits using a silicon germanium alloy wafer, but this has not produced any production chips yet that I am aware of. If this can be made to work, I see no reason why this material could not be used in VLSI designs and even higher density designs.
they have differe.nt method of deposition of film of conducting material. Hence, the difference between two is their fabrication process.
small scale integrated circuits contain about 10 transistorsmedium scale integrated circuits contain about 100 transistorslarge scale integrated circuits contain about 1000 transistorsvery large scale integrated circuits contain about 10,000 transistorsultra large scale integrated circuits contain about 100,000 transistorsetc.modern digital integrated circuits contain about 100,000,000,000 transistors and sometimes much more
VLS refers to very large scale circuits
The two largest selling types of memory integrated circuits are DRAMs and SRAMs.
Germanium diodes are more expensive than silicon ones, germanium is harder to process, germanium cannot be used to make integrated circuits (while early prototype integrated circuits were germanium the wiring between the integrated components cannot be integrated making it too expensive for production), germanium cannot operate with a junction temperature above 60C (silicon will operate up to 150C), and its reverse leakage current is greater. However! Germanium diodes have a lower forward voltage drop than silicon ones do, so they're better for some applications, like radio frequency detection.
Germanium is not used in integrated circuits. Silicon is.
Wide-angle camera lenses, fibre optic cables, and integrated circuits all contain Germanium.
Michael Simpson has written: 'Chemistry of plasmas used in the fabrication of integrated circuits'
The first integrated circuit (see image above) was a germanium bar containing a simple amplifier circuit. It was made and tested in a research lab at Texas Instruments in 1958.
Germanium cannot be used in any integrated circuit as its oxide is crumbly and water soluble (unlike silicon's oxide which is hard and stable). The only germanium integrated circuits ever made were very low density and the interconnects between components on the chip had to be done by hand under a microscope. There has been work done on integrated circuits using a silicon germanium alloy wafer, but this has not produced any production chips yet that I am aware of. If this can be made to work, I see no reason why this material could not be used in VLSI designs and even higher density designs.
Yes integrated circuits have polarity.
Peter Shepherd has written: 'Christology and dialogue' 'The Saturn experiment' 'Integrated circuit design, fabrication, and test' -- subject(s): Integrated circuits, Testing, Computer-aided design 'Gardens'
they have differe.nt method of deposition of film of conducting material. Hence, the difference between two is their fabrication process.
Mostly silicon. However various others get involved in special devices, like Germanium, Gallium Arsenic, Yttrium etc.
small scale integrated circuits contain about 10 transistorsmedium scale integrated circuits contain about 100 transistorslarge scale integrated circuits contain about 1000 transistorsvery large scale integrated circuits contain about 10,000 transistorsultra large scale integrated circuits contain about 100,000 transistorsetc.modern digital integrated circuits contain about 100,000,000,000 transistors and sometimes much more
Both hybrid integrated circuits and monolithic integrated circuits were used in third generation computers. These integrated circuits contained from 4 to 100 transistors per integrated circuit. The image above shows hybrid integrated circuits of the type used in the IBM System 360 line of computers.