Centrino is a platform-marketing initiative from Intel. It is not a mobile CPU - rather, the term covers a particular combination of mainboard chipset, mobile CPU and wireless network interface in the design of a laptop. Intel claims systems equipped with these technologies deliver better performance, longer battery life and broad wireless network interoperability.
Marketing
Intel has reportedly invested US$300 million in Centrino advertising. The Centrino marketing program has been widely assumed to be responsible for the success of Intel-based laptop PCs which promote wireless network. Because of the ubiquity of the marketing campaign, many consumers mistakenly refer to Pentium M and Intel Core processors as Centrino processor.
- Many consumers have received the impression that only Centrino provides wireless connectivity in a laptop.
- There is also some confusion with Core 2 Duo and Centrino Duo. Centrino Duo is the combination of Core 2 Duo and Intel Next Gen Wireless Systems. Core 2 Duo however is referring to the mobile CPU directly. Hence this led to new Centrino branding in 2008.
In order to qualify for a Centrino label, laptop vendors must use all three Intel-qualified parts under each platform. Using only the processor and mobile chipset will carry the Pentium M, Pentium Dual-Core, Celeron, Intel Core or Intel Core 2 label instead. Intel issues the logo sticker as part of the package deal for qualifying their products.
Although Apple uses Intel laptop components (e.g. in MacBooks), they cannot advertise as Centrino because the Intel wireless chipset is not used. Hence Apple's laptops are marketed as featuring Core 2 Duo processors with a special Apple-designed logo instead. See Apple-Intel architecture.
Centrino branding
In order for a smooth platform transition over Centrino 2, and current confusion over the Centrino logo, Intel had started to have brand names and logos changed for Napa and Santa Rosa notebook platforms in the Q2 2008 onwards.[1] Intel had announced the new processor ratings together with new Centrino logo in the Q3 2009 onwards.[2]
Notebook implementations
Carmel platform (2003)
Intel used Carmel as the codename for the first-generation Centrino platform, introduced in March 2003.
Industry-watchers initially criticized the Carmel platform for its lack of an IEEE 802.11g-solution, because many independent Wi-Fi chip-makers like Broadcom and Atheros had already started shipping 802.11g products. Intel responded that the IEEE had not finalized the 802.11g standard at the time of Carmel's launch, and that it only wanted to launch products based on a finalized standard. In early 2004, after the finalization of the 802.11g standard, Intel permitted an Intel PRO/Wireless 2200BG to substitute for the 2100. At the same time, they permitted the new Dothan Pentium M to substitute for the Banias Pentium M. Initially, Intel permitted only the 855GM chipset, which did not support external graphics. Later, Intel allowed the 855GME and 855PM chips, which did support external graphics, in Centrino laptops.
Despite criticisms, the Carmel platform won quick acceptance among OEMs and consumers. Carmel could attain or exceed the performance of older Pentium 4-M platforms, while allowing for laptops to operate for 4 to 5 hours on a 48 W-h battery. Carmel also allowed laptop manufacturers to create thinner and lighter laptops because its components did not dissipate much heat, and thus did not require large cooling systems.
Sonoma platform (2005)
Intel used Sonoma as the codename for the second-generation Centrino platform, introduced in January 2005.
The Mobile 915 Express chipset, like its desktop version, supports many new features such as DDR2, PCI Express, Intel High Definition Audio, and SATA. Unfortunately, the introduction of PCI Express and faster Pentium M processors causes laptops built around the Sonoma platform to have a shorter battery-life than their Carmel counterparts; Sonoma laptops typically achieve between 3.5-4.6 hours of battery-life on a 53 W-h battery.
Napa platform (2006)
The codename Napa designates the third-generation Centrino platform, introduced in January 2006 at the Winter Consumer Electronics Show. The platform initially supported Intel Core Duo processors but the newer Core 2 Duo processors were launched and supported in this platform from July 27, 2006 onwards.
| Centrino |
Napa platform |
| Mobile chipset |
an Intel Mobile 945 Express series chipset (codenamed Calistoga with Intel's GMA 950), including ICH7M southbridge.
|
| Mobile processor |
Processors - Socket M / Micro-FCBGA
- an Intel Core Solo, Core Duo (codenamed Yonah) processor, or
- an Intel Core 2 Duo (codenamed Merom) processor with a 667 MT/s FSB for Napa Refresh platform, or
- an Intel Core 2 Solo (codenamed Merom) processor with 553 MT/s FSB for Napa Refresh platform (Sept 2007).
|
| Wireless network |
an Intel PRO/Wireless 3945ABG mini-PCIe Wi-Fi adapter (codenamed Golan).
- Some newer models (as of 1st quarter 2007) of the Napa Refresh platform contain the newer 4965AGN (a/b/g/draft-n) wireless cards.
|
Intel uses Centrino Duo branding for laptops with dual-core (Core Duo and Core 2 Duo) processors and retains the Centrino name for laptops with single core (Core Solo) processors. Some of the initial Core Duo laptops, are still labeled as Intel Centrino rather than Centrino Duo.
Santa Rosa platform (2007)
The codename Santa Rosa refers to the fourth-generation Centrino platform, which was released on Wednesday May 9, 2007.
| Centrino |
Santa Rosa platform |
| Mobile chipset |
an Intel Mobile 965 Express series chipset (codenamed Crestline): GM965 with Intel's GMA X3100 graphics technology or PM965 with discrete graphics, and ICH8M southbridge, 800 MT/s front side bus with Dynamic Front Side Bus Switching to save power during low utilization.
|
| Mobile processor |
Processors - Socket P / Socket M / Micro-FCBGA
|
| Wireless network |
an Intel WiFi Link 4965AGN (a/b/g/draft-n) mini-PCIe Wi-Fi adapter (codenamed Kedron).
- Wireless-N technology boasts a 5X speed increase, along with a 2X greater coverage area, and supports 2.4 GHz and 5 GHz signal bands, with enough bandwidth for high definition audio and video streams.[7].
|
The Santa Rosa platform comes with dynamic acceleration technology, allowing single threaded applications to execute faster. When a single threaded application is running, the CPU can turn off one of its cores and overclock the active core. In this way the CPU maintains the same Thermal Profile as it would when both cores are active. Santa Rosa performs well as a mobile gaming platform due to its ability to switch between single threaded and multithreaded tasks. [8] Other power savings come from an Enhanced Sleep state where both the CPU cores and the chipset will power down.
The wireless chipset update was originally intended to include WWAN Internet access via HSDPA (3.5G), (codenamed Windigo) co-developed with Nokia.[9][10] After announcing a working partnership, both later retracted the deal citing the lack of a clear business case for the technology. Support for WiMAX (802.16) was originally scheduled for inclusion in Santa Rosa but appears to have been delayed until Montevina in 2008 [9].
It is branded as "Centrino Pro" when combined with the enhanced security technologies Intel introduced with vPro and "Centrino Duo" when they are not used. [11]
Montevina platform (2008)
The codename Montevina refers to the fifth-generation Centrino platform, now formally named Centrino 2 to avoid confusion with previous Centrino platforms. It was scheduled for release at Computex Taipei 2008, which took place on June 3–7, 2008,[12] but was delayed until July 15, due to problems with integrated graphics and wireless certification.[13]
| Centrino |
Montevina platform |
| Mobile chipset |
an Intel Mobile 4 Express series chipset (codenamed Cantiga; GL40, GS45, GM45, PM45) with Intel's GMA X4500 graphics technology and ICH9M southbridge, 1066 MT/s (667 MT/s for GL40) front side bus. The GM45/GS45 graphics core is clocked at 533MHz and 380MHz for GL40, which contains ten unified shaders, up from the eight provided by GMA X3100.
- RAM support for DDR2-667, DDR2-800, DDR3-800, DDR3-1066 SO-DIMM. (GL40 does not support DDR3-1066)
- NAND flash-memory caching branded as Intel Turbo Memory (codenamed Robson 2).
- Gigabit Ethernet LAN controllers 82567LM and 82567LF (codenamed Boazman).[14]
- Main support for DisplayPort with an external connector attached to the motherboard along with full supplemental support of HDMI, DVI, and VGA standards.
|
| Mobile processor |
Processors - Socket P / Socket M / Micro-FCBGA
- a second-generation Intel Core 2 Duo (codenamed Penryn) 45nm processor with 800-1066 MT/s FSB with clock speeds ranging from 2 GHz to 3.06 GHz, also featuring SSE4.1 support, which adds 47 new instructions to SSSE3. It was planned to consume no more than 29W, compared to Merom's and first-generation Penryn's 34W TDP. But after release only a few models (P series) have 25W TDP and the rest (T series) still have 35W TDP, besides the Q series (Quad core) TDP is 45W.
|
| Wireless network |
Wireless Modules
- Intel WiMAX/WiFi Link 5350 mini-PCIe (codenamed Echo Peak-P) supporting both WiMAX and up to 450Mbit/s Wi-Fi, or
- Intel Ultimate N WiFi Link 5300 mini-PCIe adapter (codenamed Shirley Peak 3x3) supporting up to 450Mbit/s, or
- Intel WiMAX/WiFi Link 5150 mini-PCIe adapter (codenamed Echo Peak-V) supporting both WiMAX and up to 300Mbit/s Rx / 150Mbit/s Tx Wi-Fi, or
- Intel WiFi Link 5100 mini-PCIe adapter (codenamed Shirley Peak 1x2) supporting up to 300Mbit/s Rx / 150Mbit/s Tx
|
It is branded as Centrino 2 vPro when combined with built-in security and manageability features technologies.
Calpella platform (2009)
The codename Calpella refers to the sixth-generation Centrino platform; it will be competing with the AMD Fusion platform. Though originally scheduled to premiere in Q3 2009 with the second iteration of Nehalem processors,[15] Intel has stated that due to pressure from computer manufacturers, they will delay the release of the platform until at least October 2009 (Q4 2009) to allow OEM partners to clear excess inventory of existing chips. This is believed to be spurred by the lowered demand due to the current unfavorable economic conditions.[16]. But as of November, the wireless adapters are still not available, hinting another possible delay for the platform.
| Centrino |
Calpella platform |
| Mobile chipset |
an Intel Mobile Express Series 5 chipset (PCHM codenamed Ibex Peak) with Intel's graphics technology that will allow for optimized decoding/encoding and editing/playback of H.264/MPEG-4 AVC video used in Blu-ray Discs and HD 1080p video, optimized for MPEG-2 (DVD) video playback and editing.
- Integrated memory controller and integrated PCI express controller remove the need for a northbridge and the older FSB technology.
- Direct connect to DisplayPort with DPCP as with its predecessor along with legacy support for HDMI (and HDCP), DVI, and VGA.
- RAM supported for DDR3-800, DDR3-1066, DDR3-1333 and DDR3-1600 SO-DIMM.
- Gigabit Ethernet LAN controllers 82577LM and 82577LF (codenamed Hanksville).
- Solid-state drive or Hybrid hard drives support.
|
| Mobile processor |
Processors - based on Intel Nehalem microarchitecture[17]
- an Intel Core i7 Extreme processor (codenamed Clarksfield-XE) 45nm for Quad Core version, 55W TDP.
- an Intel Core i7 processor (codenamed Clarksfield) 45nm for Quad Core version, 45W TDP.
- an Intel Core i5/Core i7 processor (codenamed Arrandale-SV contains 32nm Hillel and 45nm Ironlake) for Dual Core version, 35W TDP.
- an Intel Core i7 processor (codenamed Arrandale-LV contains 32nm Hillel and 45nm Ironlake) for Dual Core version, 25W TDP.
- an Intel Core i7 processor (codenamed Arrandale-ULV contains 32nm Hillel and 45nm Ironlake) for Dual Core version, 18W TDP.
|
| Wireless network |
Wireless Modules[18]
- Intel Centrino Ultimate-N 6300 AGN mini-PCIe adapter (codenamed Puma Peak 3x3), or
- Intel Centrino Advanced-N + WiMAX 6250 AGN mini-PCIe adapter (codenamed Kilmer Peak), or
- Intel Centrino Advanced-N 6200 AGN mini-PCIe adapter (codenamed Puma Peak 2x2), or
- Intel WiFi Link 1000 BGN mini-PCIe adapter (codenamed Condor Peak)
|
Huron River platform (2010)
The codename Huron River refers to the seventh-generation Centrino platform.
Mobile Internet Device
Menlow platform (2008)
On the 2nd of March 2008, Intel introduced the Intel Atom processor,[20] formerly codenamed "Menlow", a new family of low-power processors designed specifically for Mobile Internet Devices (MIDs). The components are designed with thin, small designs and work together to "enable the best mobile computing and Internet experience" on mobile and low-power devices.
| Centrino |
Menlow platform |
| Mobile chipset |
a low-power chip with PowerVR SGX 535 integrated graphics. |
| Mobile processor |
an Intel processor based on Intel Atom Architecture (codenamed Silverthorne) 45nm version. |
| Wireless network |
a wireless radio. |
Centrino Atom logo was dropped in August 2008, the logo had caused confusion between laptop and MID with previous marketing of Centrino stating only Intel chipsets are being used. Hence MIDs will be branded as Atom to allow integration with other OEM chipsets for the low-end market. [21][22]
Centrino with Intel vPro technology
Laptops Intel vPro technology have hardware features that allow a system administrator to remotely access wired and wireless laptops for maintenance and servicing if the operating system is unresponsive or crashed and, when a laptop is connected to AC power (not on battery power), allow a sys-admin to remotely access the laptop when the system is asleep or laptop power is off. It is targeted more for businesses than consumers.[23]
Security technologies
Laptops with vPro have the typical dual-core or quad-core processor and wireless features of the Centrino family.
- The vPro technology built into the chipset adds management, security, and remote-deployment features for: monitoring laptops (protected event logs, access to BIOS settings, out-of-band alerting, protected data storage), maintaining and updating systems (access to protected system information, remote power up, console redirection), repairing systems (remote boot, console redirection, preboot access to BIOS settings, protected events logs), and securing systems (remote power up, hardware filters for network traffic, agent presence checks/triggers, out-of-band alerting).
- The 45 nm Centrino 2 package is based on the Penryn CPU and Q47/Q45 chipset. It includes a better graphics engine (integrated) than Centrino, and three key additional features: Transport Layer Security (TLS) secured communications over an open local area network (LAN) for wired laptops outside the corporate firewall (not supported for wireless states), support for Microsoft Network Access Protection (NAP), and support for out-of-band management and security features in Sx (all sleep states) when the laptop is inside the corporate firewall.
See also
References
- ^ Intel Brand Names Updated
- ^ Intel processor ratings
- ^ Intel dumbs down dual Santa Rosa cores with IDA - The INQUIRER
- ^ [1] Intel® 965 Express Chipset Family Datasheet - For the Intel® 82Q965, 82Q963, 82G965 Graphics and Memory Controller Hub (GMCH) and Intel® 82P965 Memory Controller Hub (MCH)
- ^ Intel Santa Rosa Does Not Support DDR2-800
- ^ Intel Previews a New Family of Power-Saving Chips - New York Times
- ^ Rickwood, Lee. "Intel Unveils Next Gen Processor". PCWorld.ca. http://www.pcworld.ca/news/column/71f851780a010408006ca32e2485d70f/pg1.htm. Retrieved 2007-05-09.
- ^ Santa Rosa Revealed, TrustedReviews
- ^ a b Intel Wireless Connectivity Roadmap, The Register
- ^ Intel, NextGen feature Nokia chip, CNET
- ^ Santa Rosa officially dubbed Centrino Pro, engadget
- ^ Kim, Arnold (2008-02-18). "Intel Processors and Platform (Montevina) Due in June 2008". MacRumors.com. http://www.macrumors.com/2008/02/18/next-mobile-intel-processors-montevina-due-in-june-2008/.
- ^ Kircos, Bill (2008-05-28). "Intel Delays Next-Generation Centrino Chipset". pcmag.com. http://www.pcmag.com/article2/0,1759,2309998,00.asp?kc=PCRSS03069TX1K0001121.
- ^ Tony Smith (2006-10-11). "Intel to follow 'Santa Rosa' Centrino with 'Montevina'". The Register. http://www.reghardware.co.uk/2006/10/11/intel_centrino_roadmap/.
- ^ "Intel to launch Calpella notebook platform in 3Q09". digitimes.com. 2008-08-05. http://www.digitimes.com/news/a20080805PD201.html.
- ^ "Notebook vendors looking for delay of Intel's Calpella platform". digitimes.com. 2009-01-05. http://www.digitimes.com/news/a20090105PD206.html.
- ^ "CPU list". http://www.hwinfo.sk/Lists/cpu.htm.
- ^ "Intel：不會再有Centrino 3平台 Centrino品牌被降格成網絡模組品牌". 電腦領域 HKEPC Hardware. 2009-08-05. http://global.hkepc.com/3844.
- ^ "Chipset list". http://www.hwinfo.sk/Lists/chipset.htm.
- ^ Intel Announces Intel Atom Brand for New Family of Low-Power Processors
- ^ Intel Centrino Atom logo being dropped
- ^ Intel Drops Centrino Atom Brand After Five Months - Business Center - PC World
- ^ "Intel Centrino 2 with vPro technology and Intel Core2 processor with vPro technology" (PDF). Intel. http://download.intel.com/products/vpro/whitepaper/crossclient.pdf. Retrieved 2008-08-07.
External links
