Gerald Ginsberg has written:

'Electronic equipment packaging technology' -- subject(s): Electronic packaging

W J. Prise has written:

'Electronic circuit packaging'

X. J. Fan has written:

'Moisture sensitivity of plastic packages of IC devices' -- subject(s): Materials, Plastics in packaging, Moisture, Integrated circuits, Electronic packaging

Pradeep Lall has written:

'Influence of temperature on microelectronics and system reliability' -- subject(s): Reliability, Electronic apparatus and appliances, Materials, Microelectronics, Thermal properties, Electronic packaging

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