(computer science) A computer storage medium that retains information in the absence of power, such as a magnetic tape, drum, or core. Also known as nonvolatile memory.
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nonvolatile storage |
(computer science) A computer storage medium that retains information in the absence of power, such as a magnetic tape, drum, or core. Also known as nonvolatile memory.
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TechEncyclopedia:
non-volatile memory |
Refers to memory chips that hold their content without power being applied. It may refer to chips that are not changeable, such as ROMs and PROMs, or to chips that can be rewritten many times such as flash memory. Being able to hold instructions and data without power is essential in a myriad of devices because AC power can fail and batteries become depleted. Rewritability is essential in many applications as well.
Although magnetic disks hold their content without power, they are more accurately called "storage devices," rather than non-volatile memory. See memory types for more details. See future memory chips.
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Non-volatile memory |
| Computer memory types |
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| Volatile |
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| Non-volatile |
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Non-volatile memory, nonvolatile memory, NVM or non-volatile storage, in the most basic sense, is computer memory that can retain the stored information even when not powered. Examples of non-volatile memory include read-only memory, flash memory, ferroelectric RAM (F-RAM), EVMs (Electronic voting machines), most types of magnetic computer storage devices (e.g. hard disks, floppy disks, and magnetic tape), optical discs, and early computer storage methods such as paper tape and punched cards.
Non-volatile memory is typically used for the task of secondary storage, or long-term persistent storage. The most widely used form of primary storage today is a volatile form of random access memory (RAM), meaning that when the computer is shut down, anything contained in RAM is lost. Unfortunately, most forms of non-volatile memory have limitations that make them unsuitable for use as primary storage. Typically, non-volatile memory either costs more or performs worse than volatile random access memory.
Several companies are working on developing non-volatile memory systems comparable in speed and capacity to volatile RAM. IBM is currently developing MRAM (Magnetoresistive RAM). Not only would such technology save energy, but it would allow for computers that could be turned on and off almost instantly, bypassing the slow start-up and shutdown sequence. In addition, Ramtron International has developed, produced, and licensed ferroelectric RAM (F-RAM), a technology that offers distinct properties from other nonvolatile memory options, including extremely high endurance (exceeding 1016 for 3.3 V devices), ultra low power consumption (since F-RAM does not require a charge pump like other non-volatile memories), single-cycle write speeds, and gamma radiation tolerance. Other companies that have licensed and produced F-RAM technology include Texas Instruments, Rohm, and Fujitsu.
Non-volatile data storage can be categorized in electrically addressed systems (read-only memory) and mechanically addressed systems (hard disks, optical disc, magnetic tape, holographic memory, and such). Electrically addressed systems are expensive, but fast, whereas mechanically addressed systems have a low price per bit, but are slow. Non-volatile memory may one day eliminate the need for comparatively slow forms of secondary storage systems, which include hard disks.
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Electrically addressed non-volatile memories based on charge storage can be categorized according to their write mechanism:
One of the earliest forms of non-volatile read-only memory, the mask-programmed ROM was prewired at the design stage to contain specific data; once the mask was used to manufacture the integrated circuits, the data was cast in stone (silicon, actually) and could not be changed.
The mask ROM was therefore useful only for large-volume production, such as for read-only memories containing the start up code in early microcomputers. This program was often referred to as the "bootstrap", as in pulling oneself up by one's own bootstraps.
Due to the very high initial cost and inability to make revisions, the mask ROM is rarely, if ever, used in new designs.
The next approach was to create a chip which was initially blank; the programmable ROM originally contained silicon or metal fuses, which would be selectively "blown" or destroyed by a device programmer or PROM programmer in order to change 0s to 1s. Once the bits were changed, there was no way to restore them to their original condition. Non-volatile but still somewhat inflexible.
Early PAL programmable array logic chips used a similar programming approach to that used in the fuse-based PROMs.
Newer Antifuse-based PROMs (which are also referred to as one-time-programmable (OTP) memory) are widely used in consumer and automotive electronics, radio-frequency identification devices (RFID), implantable medical devices, and high-definition multimedia interfaces(HDMI) due to their small footprint, reliability, fast read speed, and long data retention rates.
There are two classes of non-volatile memory chips based on EPROM technology.
The original erasable non-volatile memories were EPROM's; these could be readily identified by the distinctive quartz window in the center of the chip package. These operated by trapping an electrical charge on the gate of a field-effect transistor in order to change a 1 to a 0 in memory. To remove the charge, one would place the chip under an intense short-wavelength fluorescent ultraviolet lamp for 20–30 minutes, returning the entire chip to its original blank (all ones) state.
An OTP is electrically an EPROM, but with the quartz window physically missing. Like the fuse, PROM it can be written once, but cannot be erased.
Electrically erasable PROMs have the advantage of being able to selectively erase any part of the chip without the need to erase the entire chip and without the need to remove the chip from the circuit. While an erase and rewrite of a location appears nearly instantaneous to the user, the write process is slightly slower than the read process; the chip can be read at full system speeds.
The limited number of times a single location can be rewritten is usually in the 10000-100000 range; the capacity of an EEPROM also tends to be smaller than that of other non-volatile memories. Nonetheless, EEPROMs are useful for storing settings or configuration for devices ranging from dial-up modems to satellite receivers.
The flash memory chip is a close relative to the EEPROM; it differs in that it can only be erased one block or "page" at a time. It is a solid-state chip that maintains stored data without any external power source.[1] Capacity is substantially larger than that of an EEPROM, making these chips a popular choice for digital cameras and desktop PC BIOS chips.
Flash memory devices use two different logical technologies—NOR and NAND—to map data. NOR flash provides high-speed random access, reading and writing data in specific memory locations; it can retrieve as little as a single byte. NAND flash reads and writes sequentially at high speed, handling data in small blocks called pages, however it is slower on read when compared to NOR. NAND flash reads faster than it writes, quickly transferring whole pages of data. Less expensive than NOR flash at high densities, NAND technology offers higher capacity for the same-size silicon.[1]
List of NOR Flash providers:[2]
List of NAND Flash providers:[4][5]
Ferroelectric RAM (FeRAM or F-RAM[6]) is a random-access memory similar in construction to DRAM but (instead of a dielectric layer like in DRAM) contains a thin ferroelectric film of lead zirconate titanate [Pb(Zr,Ti)O3], commonly referred to as PZT. The Zr/Ti atoms in the PZT change polarity in an electric field, thereby producing a binary switch. Unlike RAM devices, F-RAM retains its data memory when power is shut off or interrupted, due to the PZT crystal maintaining polarity. Due to this crystal structure and how it is influenced, F-RAM offers distinct properties from other nonvolatile memory options, including extremely high endurance (exceeding 1016 for 3.3 V devices), ultra low power consumption (since F-RAM does not require a charge pump like other non-volatile memories), single-cycle write speeds, and gamma radiation tolerance.[7]
Magnetoresistive RAM is one of the newest approaches to non-volatile memory and stores data in magnetic storage elements called magnetic tunnel junctions (MTJ's). MRAM has an especially promising future as it seeks to encompass all the desirable features of the other popular types of memory (non-volatility, infinite endurance, high-speed reading/writing, low cost).[8]
The 1st generation of MRAM, such as Everspin Technologies' 4 Mbit, utilized field induced writing. The 2nd generation is being developed mainly through two approaches: Thermal Assisted Switching (TAS)[8] which is being developed by Crocus Technology, and Spin Torque Transfer (STT) which Crocus, Hynix, IBM, and several other companies are developing.[9]
Mechanically addressed systems utilize a contact structure ('head') to read and write on a designated storage medium. Since circuitry layout is not a key factor for data density, the amount of storage is typically much larger than for electrically addressed systems.
There are polymer printed ferroelectric memory.
Thin Film Electronics ("Thinfilm") produces rewriteable non-volatile organic memory based on ferroelectric polymers. Thinfilm successfully demonstrated roll-to-roll printed memories in 2009.[10][11][12]
In Thinfilm's organic memory the ferroelectric polymer is sandwiched between two sets of electrodes in a passive matrix. Each crossing of metal lines is a ferroelectric capacitor and defines a memory cell. This gives a non-volatile memory comparable to ferroelectric RAM technologies and offer the same functionality as flash memory.
| Specification (March 2007)[13] | 2.5" HDD | 1" microdrive | Flash memory | Optical disc | Tape | MRAM |
|---|---|---|---|---|---|---|
| Device model | Hitachi Travelstar 5k160[14] | Hitachi Microdrive 3k8[15] | Hynix HY27UH08AG5M[16] | Blu-ray | HP Ultrium 960[17] | Everspin (formerly of Freescale Semiconductor) MR2A16A[18] |
| Density (GBit/cm2) | 20.3 | 18.4 | 6.7 | 3.8 | 0.047 | 0.0021 |
| Capacity (GByte) | 160 | 8 | 2 | 50 | 400 | 0.004 |
| Price per bit (Eur/GByte) | 1.5 | 9.0 | 6.0 | 1.25 | 0.075 | 35000 |
| Price per unit (Eur) | 110 | 87 | 14 | 635 | 2340 | 17.4 |
| Price per medium (Eur) (For removables) | nd | nd | nd | 40 | 30 | nd |
| Data rate (Mbit/s) | 540 | 80 | 23 | 144 | 640 | 436 |
| Access time (ms) (Average/typical) | 11 | 12 | 0.025 | 180 | 72000 | 1.000035 |
| Power consumption (W) (Average) | 1.8 | 0.6 | 0.1 | 25 | 20 | 0.08 |
| Form factor (h x w x d) (cm) | 0.95x7x10 | 0.5x3x4 | 0.1x1.2x2 | 4x15x19 | 2x10x10 | 0.1x1x1.8 |
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