What has the author John H Lau written?

Anonymous

∙ 10y ago

Updated: 8/21/2019

John H. Lau has written:

'Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies' -- subject(s): Testing, Multichip modules (Microelectronics), Reliability, Solder and soldering, Microelectronic packaging

'Solder Joint Reliability'

Wiki User

∙ 10y ago

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