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SMD parts are designed to be mounted on the same side of the circuit board as the conductive tracks. Previously, devices have wire leads or legs, that pass through holes in the board and soldered on the opposite side.
SMD parts are designed to be placed on the board by robots, controlled by computers. They are not constained by the wire leads and so can be made smaller.
The devices are accurately placed and held in place temporarily, by glue and solder paste. Once all the components have been placed, the board is heated, so that the solder paste melts and completes the electrical connections. The temperature is accurately controlled, enough to melt the paste, but not hot enough to destroy the semiconductors.
The low profile of SMDs allows very compact design. Contacts can even be placed underneath the devices in a Ball Grid Array (BGA). SMDs allow very fast construction and enable boards to be virtually printed, buy machine.
(Not very good for amateur repairs though)

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