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To improve the thermal bond between the chip and the heatsink. if the surface of the chip is uneven and the surface of the heatsink is also uneven then you wouldn't get anything close to 100% surface contact between them. To remove the gaps you use a compound that has a good thermal (heat) conductivity to fill in the gaps between the two objects.

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13y ago

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Thermal compound is used to improve the thermal conductivity between a CPU or GPU and its heatsink, helping to transfer heat more efficiently and reduce temperature. It fills in microscopic gaps and imperfections on the surfaces, allowing for better heat dissipation. Using thermal compound helps prevent overheating and improves the overall performance and lifespan of the processor.


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