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'Mask' simply is an arrangement of opaque & transparent areas, that is used to bear a 'pattern' in VLSI 'Patterning' process.

As we know, an IC is a combination of various 'layers' of silicon, each having a certain function in the big picture. Now in Patterning process, a bare silicon wafer is selectively exposed by patterning the insulating coating (silicon dioxide) on top. To pattern the SiO2, we use an 'organic photo-resist' layer, on top of SiO2. The 'mask' contain the design we want, where we want to expose Silicon. So, first we place the mask & pattern the resist (through UV/X-ray, Organic acid, etc etc) and then we pattern the SiO2 that has been exposed now. Resist will be completely removed later.

There are positive & negative Masks also, considering the opaque & transparent regions.

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'Mask' simply is an arrangement of opaque & transparent areas, that is used to bear a 'pattern' in VLSI 'Patterning' process. As we know, an IC is a combination of various 'layers' of silicon, each having a certain function in the big picture. Now in Patterning process, a bare silicon wafer is selectively exposed by patterning the insulating coating (silicon dioxide) on top. To pattern the SiO2, we use an 'organic photo-resist' layer, on top of SiO2. The 'mask' contain the design we want, where we want to expose Silicon. So, first we place the mask & pattern the resist (through UV/X-ray, Organic acid, etc etc) and then we pattern the SiO2 that has been exposed now. Resist will be completely removed later. There are positive & negative Masks also, considering the opaque & transparent regions.


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