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thin film technology corvoration is a passove electronic compoment nonugacturer servicing serving tilicommunication, medical, computing, automotive, ajnd signal integrity markets.
One of the basic building blocks in silicon wafer processing and MEMS processing is the ability to deposit thin films of material onto a wafer. One such deposition process is LPCVD Silicon Nitride, a thin film deposition process that coats all of the exposed areas of the wafer. The difference in mechanical properties between the nitride and the silicon wafer will introduce a "stress" in the wafer + nitride system.
Selecting the Right Film Stress: Choosing the correct film stress can be crucial to yield and performance of the device. For instance, if Stoichiometric Nitride (800 Mpa Tensile) is used as a KOH mask, too thick of a film can lead to micro-cracking and film failure. Switching to a Low Stress NItride (200 Mpa Tensile) will eliminate micro cracking and improve yield.
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What is the longform of wtft monitor?
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