A Dual In-Line Package (DIP) is a type of electronic component package characterized by its two parallel rows of pins, which allow for easy insertion into a printed circuit board (PCB). DIPs are commonly used for microprocessors and other integrated circuits due to their simplicity, ease of handling, and ability to be mounted on socketed or soldered connections. They typically come in various sizes and pin counts, making them versatile for different applications in electronics. However, with advancements in technology, smaller packages like surface-mount devices (SMDs) are increasingly favored for their compactness and performance.
A SIP (single inline package) is a semiconductor chip (monolith) that has one row of pins a DIP (dual inline package) is a semiconductor chip (monolith) that has two rows of pins
RIMM: Rambhous Inline Memory ModuleSIMM: Single Inline Memory ModuleDIMM: Dual Inline Memory ModuleDDRDIMM: Dual Data Rate Dual Inline Memory Module
RIMM: Rambhous Inline Memory ModuleSIMM: Single Inline Memory ModuleDIMM: Dual Inline Memory ModuleDDRDIMM: Dual Data Rate Dual Inline Memory Module
dual inline package (DIP) switch -jazzmarazz13
Dual inline package (DIP) switch
A unit with several small rocker-type switches that plugs into a dual in-line package (DIP) on a printed circuit board.
The dual inline package chip (DIP) consists of anything the chip maker wants to provide, ranging from simple logic to entire microprocessors. The DIP terminology is used to describe the physical pin layout, not the contents or the fabrication of the chip. Typically the pins are arranged in two rows, separated by either 0.3 inches or 0.6 inches, with each pin 0.1 inches apart.
dual inline memory module
The package you are talking about is called a Dual Inline Package (DIP), but this package has been (and still is) used for many other chips than just memory chips. Modern memory modules are often packaged in a Dual Inline Module (DIM), a small printed circuit board with contacts on both sides and several Flat-Pack or Surface Mount memory chips soldered to the board. There are many packages that have been used in the past and/or are now being used in the present for memory chips.
DIP stands for Dual Inline Package. Most often, the pins are on 0.1 inch centers, with two rows of pins that are either on 0.3 inch centers or 0.6 inch centers.
DIMM- DUAL INLINE MEMORY MODULE RIMM - RAMBUS INLINE MEMORY MODULE SIMM SINGLE INLINE MEMORY MODULE
SIMM (Single inline memory module), DIMM (Dual inline memory module), and RIMM (Rambus inline memory module)