What is die and wafer in CPU components?

Answer 1

A wafer is a disc of pure silicon metal cut from a manufactured rod. It is usually more than 150mm in diameter and less than a millimetre thick. It is then processed in vacuum equipment where layers of metallic, insulating and semi-conductive material are deposited on the wafer in patterns. these patterns are designed so that the completed device will have specif functions, like an amplifier or a Central Processing Unit (CPU). there are multiple devices on one wafer. The wafer is then cut up into individual devices, each one known as a die. These dies are then "packaged" into connection arrangements to make them easier to handle and connect to the motherboard.