The die is the actual chip or integrated circuit. It is the thing that does the actual processing. The rest of the package protects it and provides connections to outside devices.
L2 cache. Today's processors all have some memory on the processor chip (called a die). Memory on the processor die is called Level 1 cache (L1 cache). Memory in the processor package, but not on the processor die, is called Level 2 cache (L2 cache). Some processors use a third cache farther from the processor core, but still in the processor package, which is called Level 3 cache (L3 cache).
L1, L2 and L3 (depending on the age of your motherboard and processor)
XP Home Edition is limited to one processor DIE. It can have any number of CORES. XP can see all of the cores of a Core 2 Quad, for instance. Even if the system in question had two separate die, or chips, XP would still work. It just wouldn't be able to use the second processor.
Level 2 cache (L2 cache)
atc bus
Level 2 cache (L2 cache)
Execution Trace Cache
Multi-core
If you are actually able to see the processor die, you should be able to read the text written on the top of the processor.
The discrete L2 is located within the processor housing, on a separate chip. The Advanced Transfer Cache is located directly on the processor die itself.
aray processor is a processor that performs computations on large arrays of data. It is of two types: (1) attached array processor. (2)SIMD array processor.
The Intel 80486DX is a 32-bit processor that was released by Intel in 1989. It was the first to include its own floating point unit on the same die. 80486SXs are different in that they have this component disabled to make the processor cheaper.