Masking is an important process in IC fabrication that is used at every step whether its doping, oxidization, metallization, passivization, etc.
Masking at its simplest is done as follows:
The presence of the plastic resin prevents the given fabrication step from affecting that area of the wafer surface while the absence of the plastic resin allows the given fabrication step to affect that area of the wafer surface.
In certain fabrication steps the plastic resin would not be a satisfactory mask itself (e.g. steps performed in a furnace). For these steps a layer of silicon dioxide or silicon nitride is grown on the wafer surface and the masking with the plastic resin is used to etch away the silicon dioxide or silicon nitride which is then used as the mask to complete the difficult fabrication step. The silicon dioxide or silicon nitride layer is then removed.
A similar masking process is used in etching printed circuit boards.
The first known historical examples of masking being used was by metal engravers, who would take the piece of metal to be engraved and paint it with tar. When the tar set they would draw the pattern to be engraved on the tar with sharp tools, exposing bare metal in the scratches. The tar covered metal object was then immersed in a strong acid for a period of time. When removed from the acid the tar would be cleaned off, leaving an acid engraving.
Manufacturing of IC is known as Fabrication of IC.... it is fabricated from silica(sand)... Inside an IC u can see a small silicon sheet where the actual circuits are imprinted by a process... from that small sheet wires are drawn and fabricated into a IC......
its the process of injecting ions of one material into other there are different types of diffusion substitutional and interstitial ...
ic made from bjt is known as bipolar ic
op amp linear ic 7805 non linear ic
4026
Vacuum sublimation
Metallization is a technique used to form metal contacts and interconnects in the fabrication of ICs.
VLSI deals with fabrication of an IC (integrated circuit) or a chip. The design and fabrication of an IC is vital in prototyping any system. In order to implement any application, the basic requirement is an IC. Hence, VLSI which is used to fabricate bulk number of ICs is becoming popular.
Lithography is a technique used to make patterns on semiconductor materials.
Manufacturing of IC is known as Fabrication of IC.... it is fabricated from silica(sand)... Inside an IC u can see a small silicon sheet where the actual circuits are imprinted by a process... from that small sheet wires are drawn and fabricated into a IC......
Its the ordered growth of a material on the same material such that there vl be no any type of mismatch in their interface.
its the process of injecting ions of one material into other there are different types of diffusion substitutional and interstitial ...
Nanotechnology is currently a wide field of research and applications in fields ranging from biology to semiconductor fabrication. An example in biology is the design and fabrication of extremely small and sensitive chemical sensors. An example in semiconductors is the lithographic creation of IC chips.
If I am not mistaken, there are two distinct fabrication disciplines applied to integrated circuitry. Commercial specifications, (plastic) and Military specifications (ceramic). Although for purposes of manufacturing, and integration, the obvious reasons are to afford more tolerance when heat, shock, liquids, etc, are applied to the ic's and YES ceramic chips are able to handle the rigors of harsher environments.
This difficulty arises due to the fact that the IC fabrication techniques are layer oriented which typically involve processes which are applied to multiple horizontal surfaces in a sequential fashion. However the inductive circuits has a "non-planar" configuration which typically has a continuous spiral shape. This particular spiral configuration thus prevents the IC fabrication to integrate the inductive circuits as part of the IC devices.
Annealing is the heat treatment given to a semiconductor material. Annealing is the process by which the lattice damages are repaired. The damages are generally done by ion implantation on semiconductor material.
Masking is Softwear