IDK y r u askingme?
No, tin does not contain lead. Tin is a separate element from lead and does not naturally contain lead in its composition.
Tin and lead makes pewter
Very easily. A wire form of an lead-tin alloy is often found as wire solder.
Solder Also Pewter is a malleable metal alloy, traditionally 85-99% tin, with the remainder consisting of copper, antimony, bismuth and lead.
No, lead does not react with tin nitrate under normal conditions. Lead is a less reactive metal and is unlikely to displace tin in a compound like tin nitrate.
no cause its TIN TIN THE MOVIE
Zinc was often confused with lead and tin due to their similar appearances. However, zinc has a higher melting point than lead and tin, and it does not oxidize easily like lead and tin.
Lead has more protons. Lead contains 82 protons, while tin only contains 50.
Tin is typically found as the compound tin dioxide, also known as cassiterite.
Tin is more conductive. Lead is used to ease application.
Yes, lead nitrate and tin nitrate can react together to form insoluble lead(II) tin(IV) oxide when subjected to appropriate conditions. This reaction involves the displacement of lead with tin, resulting in the creation of the new compound.
If the question relates to solder or tin-lead plating of electronic components to prevent tin whiskers from growing then the answer is a minimum of 3% lead in the tin solder. Eutectic tin-lead solder for electronics is 63% tin 37% lead. Due to the European Union's lead ban (environmental regulation called RoHS), non-lead tin solders have been developed; SAC alloys (tin-silver-copper) being most common. A higher temperature is required to melt solders that do not contain lead. As of this writing (Oct 2010), there is no adequate substitute for lead. Tin whiskers may grow and eventually cause electronic products to fail and we do not know why that happens or how long it takes for them to grow. One scientist at NASA aptly summarized the situation: "Sometimes tin whiskers" For sheetmetal (copper, tin plate, galvanized steel plate soldering, 50% tin - 50% lead is preferred. 50-50 was used for copper plumbing until lead was banned (concerns about water quality). Silver replaced the lead and a higher temperature was required to melt it.