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Metal-Oxide-Semiconductor, the 3 layers of material making the device:

  • Metal - the top layer, usually aluminum, interconnects the components of the IC.
  • Oxide - the middle layer, silicon dioxide, insulates the metal and semiconductor from each other where connections are not wanted and passivates the edges of the semiconductor junctions.
  • Semiconductor - the bottom layer, silicon, the components are in this layer.

While this layering equally describes bipolar and FET based ICs, it is usually only used to refer to FET based ICs.

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13y ago

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