answersLogoWhite

0

In the manufacturing process of a sim card, conductive modules are formed on the surface of a substrate to form the sim card body. The substrate is trimmed and an IC chip is bonded to the substrate. Then, the IC chip is encapsulated, a molding part is formed to cover the chip and flatten the bottom of the sim card to comply with industry standards.

User Avatar

Wiki User

11y ago

What else can I help you with?