Fluorosilicate glass (FSG) is a dielectric used in between copper metal layers during silicon integrated circuit fabrication process. It has a low dielectric constant (k) and is now widely adopted by semiconductor foundries on geometries sub 0.25u, also Intel started using Cu metal layers and FSG on its 1.2 GHz Pentium processor at 130 nm CMOS. TSMC (Taiwan Semiconductor Manufacturing Company) brought in FSG and copper together in the Altera APEX.
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