no, the 741 opamp is a monolithic IC.
pin1to 8 is used in ic741
How ic 741 works?
power supplies +5v and -5v will be given to 7 and 4 pins respectively,therefore it is used for giving power suppply to ic 741
low cost high reliability
An analog and digital integrated circuit.Wrong, a hybrid IC is a device composed of individual separate components mounted on a tiny ceramic printed circuit board and encapsulated in a metal case or plastic resin. This is in contrast to a monolithic IC that contains everything on a single semiconductor chip.An IC having both analog and digital functions is called a mixed signal IC.
Yes an Op-amp
no thing .............hahaha
IC741 has a low slew rate because of the predominance of capacitance present in the circuit at higher frequencies. As frequency increases the output gets distorted due to limited slew rate.
An IC or integrated circuit consists of a chip ("die") and plastic or ceramic packaging to protect the die from mechanical and (some) electrical damage. An IC with more than one die is usually called a "hybrid" IC. A "monolithic" IC is just a plain old one-die IC, but it implies that functions from a number of ICs have been incorporated into that one IC. One form of monolithic IC is where the functions of a powerful graphics processor is put on the same die as a CPU. An SOC ("System On a Chip") is another trend in monolithic ICs. "Monolithic" is something of a transitional term. Floating point, memory management, and processing units all used to to be on separate ICs. Now they are all on the same IC, but we don't call them "monolithic" any more.
The IC code is on the actual IC, you can find out its details by searching the IC code on Google.
MONOLITHIC IC It is that the components such as semiconductor materials,passive components(resistor,capacitor,inductor and transformer) etc ,which is used in ic is fabricated within the single semiconductor(say silicon) wafer and there is no such shortages between the components and this have separate pn junctions. All the functions of the components are within the small silicon wafer and the technology used here to manufacture this ic is PLANAR TECHNOLOGY HYBRID IC It is that the components are connected individualy through the wires and the surrounded by the special polymer called EPOXY ,this is the technology used while comparing with the monolithic ic it is big in size.it contain the components all such used in the monolithic type
ic made from bjt is known as bipolar ic