Tin and lead make solder.
Any of various fusible alloys, usually tin and lead, used to join metallic parts.
There are two formulas, one containing 71.5 parts of tin to 27.8 of lead, the other 78.2 of tin to 21.7 of lead.
Bronze is made from lead, tin, and copper; if you leave out the copper you get an impoverished bronze.
If the question relates to solder or tin-lead plating of electronic components to prevent tin whiskers from growing then the answer is a minimum of 3% lead in the tin solder. Eutectic tin-lead solder for electronics is 63% tin 37% lead. Due to the European Union's lead ban (environmental regulation called RoHS), non-lead tin solders have been developed; SAC alloys (tin-silver-copper) being most common. A higher temperature is required to melt solders that do not contain lead. As of this writing (Oct 2010), there is no adequate substitute for lead. Tin whiskers may grow and eventually cause electronic products to fail and we do not know why that happens or how long it takes for them to grow. One scientist at NASA aptly summarized the situation: "Sometimes tin whiskers" For sheetmetal (copper, tin plate, galvanized steel plate soldering, 50% tin - 50% lead is preferred. 50-50 was used for copper plumbing until lead was banned (concerns about water quality). Silver replaced the lead and a higher temperature was required to melt it.
Solder is a fusible alloy that is used to join less fusible metals or wires,Combinations of tin and lead are most common, in ratios of 60 percent tin to 40 percent lead; 63 percent tin to 37 percent lead; and 50 percent tin to 50 percent lead.
Tin and lead makes pewter
no cause its TIN TIN THE MOVIE
Any of various fusible alloys, usually tin and lead, used to join metallic parts.
Lead has more protons. Lead contains 82 protons, while tin only contains 50.
Tin is more conductive. Lead is used to ease application.
No, because tin is above lead in the activity series.
There are two formulas, one containing 71.5 parts of tin to 27.8 of lead, the other 78.2 of tin to 21.7 of lead.
If the question relates to solder or tin-lead plating of electronic components to prevent tin whiskers from growing then the answer is a minimum of 3% lead in the tin solder. Eutectic tin-lead solder for electronics is 63% tin 37% lead. Due to the European Union's lead ban (environmental regulation called RoHS), non-lead tin solders have been developed; SAC alloys (tin-silver-copper) being most common. A higher temperature is required to melt solders that do not contain lead. As of this writing (Oct 2010), there is no adequate substitute for lead. Tin whiskers may grow and eventually cause electronic products to fail and we do not know why that happens or how long it takes for them to grow. One scientist at NASA aptly summarized the situation: "Sometimes tin whiskers" For sheetmetal (copper, tin plate, galvanized steel plate soldering, 50% tin - 50% lead is preferred. 50-50 was used for copper plumbing until lead was banned (concerns about water quality). Silver replaced the lead and a higher temperature was required to melt it.
Bronze is made from lead, tin, and copper; if you leave out the copper you get an impoverished bronze.
No, most metals do not react with each other, By melting "together" you'll make a mixture named Lead-Tin alloy: Tin forms a eutectic mixture with lead containing 63% tin and 37% lead, used as "solder"
Lead. The densities of lead and tin are 11.34 g/cm^3 and ~7 g/cm^3, respectively. Lead solder is an alloy made of mostly lead and tin; a mixture of lead and tin will weigh less than 100% lead. Lead-free solders are made of tin, copper, silver, indium, bismuth, zinc, antimony, and other metals; none of these metals is heavier than lead. So, lead is the champion.
Solder is a fusible alloy that is used to join less fusible metals or wires,Combinations of tin and lead are most common, in ratios of 60 percent tin to 40 percent lead; 63 percent tin to 37 percent lead; and 50 percent tin to 50 percent lead.