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If the question relates to solder or tin-lead plating of electronic components to prevent tin whiskers from growing then the answer is a minimum of 3% lead in the tin solder. Eutectic tin-lead solder for electronics is 63% tin 37% lead.

Due to the European Union's lead ban (environmental regulation called RoHS), non-lead tin solders have been developed; SAC alloys (tin-silver-copper) being most common. A higher temperature is required to melt solders that do not contain lead.

As of this writing (Oct 2010), there is no adequate substitute for lead. Tin whiskers may grow and eventually cause electronic products to fail and we do not know why that happens or how long it takes for them to grow. One scientist at NASA aptly summarized the situation:

"Sometimes tin whiskers"

For sheetmetal (copper, tin plate, galvanized steel plate soldering, 50% tin - 50% lead is preferred. 50-50 was used for copper Plumbing until lead was banned (concerns about water quality). Silver replaced the lead and a higher temperature was required to melt it.

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