Ask your Chemistry teacher about this.
a higher temperature increases elasticity to fabric as temperature breaks bonds between molecules of the fabric
Homolytic bond dissociation energy is when a covalent bond breaks evenly, with each atom keeping one electron. Heterolytic bond dissociation energy is when a covalent bond breaks unevenly, with one atom keeping both electrons.
Hydrolysis.
Hydrolysis is the type of reaction that breaks covalent bonds by the addition of water molecules. In hydrolysis, a water molecule is split and its components (H and OH) are added to the atoms within the covalent bond, breaking it apart. This process is commonly involved in the breakdown of large molecules into smaller ones during digestion.
Sometimes, but not usually. The covalent bond in HCl, for example, breaks when the gas is dissolved in water, but the bonds in methanol, acetone, and most other organic compounds do not.
It is used to raise the temperature of the water.
The temperature heats the rock and breaks it (erodes).
a very polar, single, covalent bond, yes. This would be an ionic bond. The electronegativity of Hydrogen is about 2.2 and the electronegativity of Fluorine is about 4.0. The difference is 1.8 which is greater than 1.7, the minimum difference for an ionic bond. Or it is (at least) a very polar-covalent bond. Figures 1.7 or 1.8 are in the 'discussion' range
No. Oxygen (O2) even if it breaks up into two Oxygen atoms is not ionic. It Is A Covalent Molecule Though.
The basic function of saliva is to moisten and Lubricate food. Saliva also contains salivary amylase which breaks the covalent bonds between glucose molecules in starch and other polysaccharides to produce the disaccharides maltose and isomaltose.
The enzyme that breaks the bonds between the complementary parent strands during DNA replication is DNA helicase. DNA helicase unwinds the double helix by breaking the hydrogen bonds between the base pairs, allowing for the strands to separate and be copied.
The oxide of silicon is a stable insulating insoluble solid, making it possible to integrate the metal interconnects in planar layers over the semiconductor. The oxide of germanium is unstable and soluble in water, making it necessary to connect the integrated components with individual wires which is far too labor intensive and is also impractical for integration levels beyond MSI. Texas Instruments made some prototype SSI germanium ICs this way in 1958 and 1959 but abandoned the process when they licensed Fairchild's planar silicon IC process. No ICs are made of germanium now, only discrete transistors and diodes. Some work has been done on ICs made of silicon-germanium alloy, but I am not sure of the current status.