this process involves following major steps... 1. Wafer preparation 2. Epitaxial growth 3. Oxidisation 4. Photolithographic process 5. Isolation diffusion 6. Base and emitter diffusion 7. Pre-ohmic etch 8. Metallisation 9. circuit probing 10. Scribing and separating into chips 11. Mounting and packing 12. Encapsulation (NOTE;- These are the processes involved for monolithic ic's. Detailed information can be found on internet.)
An IC or integrated circuit consists of a chip ("die") and plastic or ceramic packaging to protect the die from mechanical and (some) electrical damage. An IC with more than one die is usually called a "hybrid" IC. A "monolithic" IC is just a plain old one-die IC, but it implies that functions from a number of ICs have been incorporated into that one IC. One form of monolithic IC is where the functions of a powerful graphics processor is put on the same die as a CPU. An SOC ("System On a Chip") is another trend in monolithic ICs. "Monolithic" is something of a transitional term. Floating point, memory management, and processing units all used to to be on separate ICs. Now they are all on the same IC, but we don't call them "monolithic" any more.
low cost high reliability
Metallization is a technique used to form metal contacts and interconnects in the fabrication of ICs.
Lithography is a technique used to make patterns on semiconductor materials.
all the parts in the IC were made together so they have nearly identical characteristicsthe parts are close together in the IC so are probably at nearly the same temperature
no, the 741 opamp is a monolithic IC.
An IC or integrated circuit consists of a chip ("die") and plastic or ceramic packaging to protect the die from mechanical and (some) electrical damage. An IC with more than one die is usually called a "hybrid" IC. A "monolithic" IC is just a plain old one-die IC, but it implies that functions from a number of ICs have been incorporated into that one IC. One form of monolithic IC is where the functions of a powerful graphics processor is put on the same die as a CPU. An SOC ("System On a Chip") is another trend in monolithic ICs. "Monolithic" is something of a transitional term. Floating point, memory management, and processing units all used to to be on separate ICs. Now they are all on the same IC, but we don't call them "monolithic" any more.
linear monolithic
LM stands for "Linear Monolithic"
low cost high reliability
Vacuum sublimation
It's a prefix of the IC products of 'Linear Monolithic' category of National semiconductors.
Metallization is a technique used to form metal contacts and interconnects in the fabrication of ICs.
this process involves following major steps... 1. Wafer preparation 2. Epitaxial growth 3. Oxidisation 4. Photolithographic process 5. Isolation diffusion 6. Base and emitter diffusion 7. Pre-ohmic etch 8. Metallisation 9. circuit probing 10. Scribing and separating into chips 11. Mounting and packing 12. Encapsulation (NOTE;- These are the processes involved for monolithic ic's. Detailed information can be found on internet.)
Full form of LM in any IC like LM317 is linear monolithic
LM stand for Liner Monolithic ic that is the National Instrunt perfix, I My right
A monolithic IC is a type of "integrated circuit" electronic device (commonly referred to as a "chip") that contains active and passive devices (transistors, diodes, resistors, capacitors) that are made in and on the surface of a single piece of a single crystal semiconductor, such as a Silicon (Si) wafer. A process called "planar technology" must be used in the single block (monolith), and be interconnected to the insulating layer over the same body of the semiconductor to produce a solid integral monolithic-IC. If the devices are interconnected by bonding wires dangling above the chip, is not a monolithic-IC; it is a hybrid-IC. In monolithic-ICs, the devices (transistors, diodes, resistors and capacitors) are fabricated on the same single chip of a single Silicon crystal by PLANAR technology, and have ISOLATED p-n junctions, and have interconnections adherent to the insulator layers without shorting to the adjacent areas and each other.