this process involves following major steps... 1. Wafer preparation 2. Epitaxial growth 3. Oxidisation 4. Photolithographic process 5. Isolation diffusion 6. Base and emitter diffusion 7. Pre-ohmic etch 8. Metallisation 9. circuit probing 10. Scribing and separating into chips 11. Mounting and packing 12. Encapsulation (NOTE;- These are the processes involved for monolithic ic's. Detailed information can be found on internet.)
An IC or integrated circuit consists of a chip ("die") and plastic or ceramic packaging to protect the die from mechanical and (some) electrical damage. An IC with more than one die is usually called a "hybrid" IC. A "monolithic" IC is just a plain old one-die IC, but it implies that functions from a number of ICs have been incorporated into that one IC. One form of monolithic IC is where the functions of a powerful graphics processor is put on the same die as a CPU. An SOC ("System On a Chip") is another trend in monolithic ICs. "Monolithic" is something of a transitional term. Floating point, memory management, and processing units all used to to be on separate ICs. Now they are all on the same IC, but we don't call them "monolithic" any more.
low cost high reliability
Metallization is a technique used to form metal contacts and interconnects in the fabrication of ICs.
Lithography is a technique used to make patterns on semiconductor materials.
Its the ordered growth of a material on the same material such that there vl be no any type of mismatch in their interface.
no, the 741 opamp is a monolithic IC.
An IC or integrated circuit consists of a chip ("die") and plastic or ceramic packaging to protect the die from mechanical and (some) electrical damage. An IC with more than one die is usually called a "hybrid" IC. A "monolithic" IC is just a plain old one-die IC, but it implies that functions from a number of ICs have been incorporated into that one IC. One form of monolithic IC is where the functions of a powerful graphics processor is put on the same die as a CPU. An SOC ("System On a Chip") is another trend in monolithic ICs. "Monolithic" is something of a transitional term. Floating point, memory management, and processing units all used to to be on separate ICs. Now they are all on the same IC, but we don't call them "monolithic" any more.
linear monolithic
Vacuum sublimation
LM stands for "Linear Monolithic"
low cost high reliability
It's a prefix of the IC products of 'Linear Monolithic' category of National semiconductors.
Metallization is a technique used to form metal contacts and interconnects in the fabrication of ICs.
this process involves following major steps... 1. Wafer preparation 2. Epitaxial growth 3. Oxidisation 4. Photolithographic process 5. Isolation diffusion 6. Base and emitter diffusion 7. Pre-ohmic etch 8. Metallisation 9. circuit probing 10. Scribing and separating into chips 11. Mounting and packing 12. Encapsulation (NOTE;- These are the processes involved for monolithic ic's. Detailed information can be found on internet.)
LM stand for Liner Monolithic ic that is the National Instrunt perfix, I My right
Full form of LM in any IC like LM317 is linear monolithic
VLSI deals with fabrication of an IC (integrated circuit) or a chip. The design and fabrication of an IC is vital in prototyping any system. In order to implement any application, the basic requirement is an IC. Hence, VLSI which is used to fabricate bulk number of ICs is becoming popular.