Gallium is a metal, not a semiconductor. You cannot build a transistor or even a diode with a piece of metal, forget an IC chip containing several transistors.
To create a gallium based semiconductor, it must be ALLOYED with one or more of the following elements: nitrogen, phosphorus, arsenic, or antimony. The simplest semiconductor alloys are: gallium nitride, gallium phosphide, gallium arsenide, and gallium antimonide. Examples of other semiconductor alloys are: gallium nitride phosphide, gallium phosphide arsenide, etc. (these are used in some types of LEDs).
The most common gallium alloy semiconductor for making transistors and IC chips is gallium arsenide. Compared to both silicon and germanium, transistors made of gallium arsenide are significantly faster, and additional speed can be obtained by using nonsaturating logic circuits like ECL.
Germanium cannot be used in any integrated circuit as its oxide is crumbly and water soluble (unlike silicon's oxide which is hard and stable). The only germanium integrated circuits ever made were very low density and the interconnects between components on the chip had to be done by hand under a microscope. There has been work done on integrated circuits using a silicon germanium alloy wafer, but this has not produced any production chips yet that I am aware of. If this can be made to work, I see no reason why this material could not be used in VLSI designs and even higher density designs.
integrated circuits and components made in GaAs are much faster than silicon because its low field electron mobility is larger than silicon. GaAs has ability to emit light used in leds,lasers and microwave emitter used in cellular phones
The invention of the planar process by which most IC devices are fabricated relies on the gas phase diffusion of dopants to produce N-type and P-type regions, but also on the ability of silicon dioxide to mask these diffusion processes and passivate the chip surface eliminating the need for hermetic packaging. Silicon is unique in its ability to be oxidized to produce a stable insulating coating. Germanium dioxide is crumbly and water soluble, making it impossible to use in this process. While the first IC made used germanium, it had to be handwired which would have made them prohibitively expensive to produce and much larger than even the early silicon ICs.
plug the chip into a socket
Chip Designing: Chip Designing is how to built a Chip means what are the Steps involved and how to make a chip from Concept,Architecture,Follow Chip Design Flow and Fabricate in a Foundry for a specific process. An Analogy is mentioned to understand the chip designing concept with an well known architecture(Building) and Detailed explanation on the VLSI(Very large scale integration) Flow (what is the methodology involved in chip dEsigning). Chip Programming : Configuration of the Chip can be modified dynamically using Fusing or some other methods.
Yes. Gallium is used as a "dopant", a calculated impurity that turns the silicon that makes up the computer chip from a nonconductor to a semiconductor.
Mostly silicon but other compounds such as gallium arsenide are also used.
CPU chip
point contact transistors were made by taking a germanium chip and placing the tips of 2 sharpened metal wires on that chip very close to each other, then a capacitor of a specified value was charged to a specified voltage and discharged between the chip and the wire intended to be the emittergrown junction transistors were made by pulling a germanium crystal from molten germanium that was already doped, a bead of the opposite dopant material was dropped into the molten germanium forming the base, then a bead of the original dopant material was dropped into the molten germanium forming the collector, this crystal (about the size of the eraser on the end of a pencil) was then carefully cut into individual transistorsalloy junction transistors were made by taking a germanium chip that was already doped, 2 metal alloy beads containing the opposite dopant were pressed against opposite sides of that chip and the assembly was heated until the beads barely began to melt and fused into the chipsurface barrier transistors were made by taking a germanium chip that was already doped, acid etching pits on opposite sides of the chip until the pits almost but not quite touched, washing the chip, then electroplating the 2 pits with metaldiffusion transistors (the modern kind, both junction and field effect) are made by diffusing dopants at high temperature as needed into large silicon wafers (note: the first diffusion transistors were made on individual germanium chips like most earlier transistors) to construct the various elements of the transistors, the wafers are then cut up to make the finished device whether it is individual transistors or complicated microprocessors containing hundreds of billions of transistors
Yes :)
If you drop it or use something hard on the screen, you might chip it.
That depends on what type of chip you like. Joe might say yes but Steve might say no.
There might be
Kilby at TI did the first one using Germanium for his chips. The only thing not integrated was the wiring. The next year workers at Fairchild used Silicon and integrated everything.
If it smokes without a "chip" it might have a failed injector.
I guess but it might be impossible
you can but it might chip a little