No, most metals do not react with each other,
By melting "together" you'll make a mixture named Lead-Tin alloy:
Tin forms a eutectic mixture with lead containing 63% tin and 37% lead, used as "solder"
Solder melts before pure tin or pure lead because the molecules of the tin and the lead which make up the solder have not bonded chemically (they have only been mixed together so there has been not chemical reaction), so can easily vibrate quicker, therefore they will melt quicker.
The temperature on the surface of Venus is about 461.85 °C this hot enough to melt zinc which melts at 419.53 °C, lead which melts at 327.46 °C and tin which melts at 231.93 °C
Zinc, Lead, Tin any metal that is on the softer side would melt.
Lead and tin are good conductors, as are all metals. That is a result of the metallic bond, in which the constituent atoms in a piece of metal share their electrons with each other in the form of a cloud of electrons, all of which can move very freely and are not attached to any particular atom or region.
Solder Also Pewter is a malleable metal alloy, traditionally 85-99% tin, with the remainder consisting of copper, antimony, bismuth and lead.
Solder melts before pure tin or pure lead because the molecules of the tin and the lead which make up the solder have not bonded chemically (they have only been mixed together so there has been not chemical reaction), so can easily vibrate quicker, therefore they will melt quicker.
you have to melt it! the lead sinks to the bottom because it is a heaver metal.
The temperature on the surface of Venus is about 461.85 °C this hot enough to melt zinc which melts at 419.53 °C, lead which melts at 327.46 °C and tin which melts at 231.93 °C
If the question relates to solder or tin-lead plating of electronic components to prevent tin whiskers from growing then the answer is a minimum of 3% lead in the tin solder. Eutectic tin-lead solder for electronics is 63% tin 37% lead. Due to the European Union's lead ban (environmental regulation called RoHS), non-lead tin solders have been developed; SAC alloys (tin-silver-copper) being most common. A higher temperature is required to melt solders that do not contain lead. As of this writing (Oct 2010), there is no adequate substitute for lead. Tin whiskers may grow and eventually cause electronic products to fail and we do not know why that happens or how long it takes for them to grow. One scientist at NASA aptly summarized the situation: "Sometimes tin whiskers" For sheetmetal (copper, tin plate, galvanized steel plate soldering, 50% tin - 50% lead is preferred. 50-50 was used for copper plumbing until lead was banned (concerns about water quality). Silver replaced the lead and a higher temperature was required to melt it.
Pure lead melts at 327.5°C, but it is often alloyed with tin which melts at about 232°C. The melting point of a lead-tin alloy would be somewhere between these two values, depending on the proportions of each element in the alloy.
Zinc, Lead, Tin any metal that is on the softer side would melt.
Tin and lead makes pewter
Tin and lead make solder.
You melt a mixture of products together--they don't necessarily have to be metals, but usually are. For instance, copper mixed with tin forms bronze.
solder--its an alloy used 4 joining metals
Tin melts at 505 K.
Tin can form weakly ionic bonds with several non metals including oxygen, sulfur and chlorine.