Very Large Scale Integration (VLSI)

VLSI Era:- Very Large Scale Integration Era

VHDL is a hardware description language. XILINX is an EDA tool.

EDA tools, electronic design and automation tools, are used to implement the programs like VHDL or Verilog. VHDL has several versions. But all these are standardized by IEEE and they don't belong to XILINX. Several FPGAs and CPLDs are manufactured by XILINX.

how can i break bios password without remove cmos battery

vhdl code for ascending order of numbers

"Physical design" part in the VLSI flow starts from the floorplanning and ends at tapeout of GDSII file.

It includes, floorplanning, power planning, placement, clock tree synthesis, routing, post routing optimizations, physical verification, DFM, DFY, SI Analysis, IR drop analysis, Signoff.

Depending on the design methodologies used, three types of timing analysis methods are commonly used:

1. Manual analysis

2. Static timing analysis

3. Dynamic timing analysis

We need STA in VLSI - ASIC because of these reasons: # To analyze the timing relationships of a given circuit to verify that the circuit works at the specified frequency (verification). # 100 % path coverage is possible because no design specific pattern is required. # You can't achieve the clock speed without it.

The synthesis netlist is input to the placement process. The place and route process places each macro from the synthesis netlist into an available location on the target silicon and connects the macros using routing resources available on the target silicon. The placement process analyzes all of the macros used in the design and their connectivity to try to determine an optimal placement for the macros. The placement algorithms take into account a number of technology-specific factors of the target technology to determine whether a particular placement is good or not. After a trial placement and signal route is attempted, the design is analyzed with respect to timing constraints. If the timing constraints are not met, the place and route software continues to try different placements and signal routing to try to meet the constraints.

Typical target devices have areas of the chip where logical functions are placed, and areas where interconnect signals are routed to connect the logical functions. The device is split into a number of logic areas with routing channels that surround the logic areas. Logic areas contain the logical gates to implement the Boolean function of the design. Routing channels contain the signals that are used to connect the logical gates together. For FPGA devices, the routing channels contain programmable interconnect wires. FPGA devices use an onboard RAM to store the value of programmable switches that are used to form the signal interconnections. By enabling the proper sets of pass transistor gates, signal interconnections between logic gates can be formed

Verification in VHDL is timing verification.

VLSI abbreviates to Very Large Scale Integration. VLSI is a chip design flow, to design Integrated circuits or IC chips. The chip in the mobile phone will enable functionality like Digital Signal Processing[DSP], Base band processing, Security, communication protocols like GSM/CDMA ...

Top down approach is based on Chip level flow, If the design is small then we can opt for this approach . Bottom down approach is hierarchical based chip design flow, If our Design is big, then , the chip is divided in to small manageable modules, it is similar to "Divide and Conquer approach", Finish the small manageable modules , so that the run time will be controlled, and then finally integrate in to one-chip.

Most microfluidics use "standard" lithography techniques for patterning hard substrates such as glass or silicon. This would entail spinning photoresist, then exposing and wet etching in KOH (silicon) or HF (glass) or dry etching in a reactive ion etcher or deep reactive ion etcher. Soft lithography is also common in microfluidics where a mask is created using a hard material such as patterned SU-8 or etched glass. A polymer such as PDMS is then cast on the mold to create the microfluidic features.

The ticker symbol for Xilinx is XLNX and it is traded on the Nasdaq.

Lithography is the process of printing a lithograph on a hard surface.

Step 1: Prepare an Requirement Specification

Step 2: Create an Micro-Architecture Document.

Step 3: RTL Design & Development of IP's

Step 4: Functional verification all the IP's/Check whether the RTL is free from Linting Errors/Analyze whether the RTL is Synthesis friendly.

Step 4a: Perform Cycle-based verification(Functional) to verify the protocol behaviour of the RTL

Step 4b: Perform Property Checking , to verify the RTL implementation and the specification understanding is matching.

Step 5: Prepare the Design Constraints file (clock definitions(frequency/uncertainity/jitter),I/O delay definitions, Output pad load definition, Design False/Multicycle-paths) to perform Synthesis, usually called as an SDC file(Synopsys constraint file, specific to synopsys synthesis Tool (design-compiler)

Step 6: To Perform Synthesis for the IP, the inputs to the tool are (library file(for which synthesis needs to be targeted for, which has the functional/timing information available for the standard-cell library and the wire-load models for the wires based on the fanout length of the connectivity), RTL files and the Design Constraint files, So that the Synthesis tool can perform the synthesis of the RTL files and map and optimize to meet the design-constraints requirements. After performing synthesis, as a part of the synthesis flow, need to build scan-chain connectivity based on the DFT(Design for Test) requirement, the synthesis tool (Test-compiler), builds the scan-chain.

7: Check whether the Design is meeting the requirements (Functional/Timing/Area/Power/DFT) after synthesis.

Step 7a: Perform the Netlist-level Power Analysis, to know whether the design is meeting the power targets.

Step 7b: Perform Gate-level Simulation with the Synthesized Netlist to check whether the design is meeting the functional requirements.

Step 7c: Perform Formal-verification between RTL vs Synthesized Netlist to confirm that the synthesis Tool has not altered the functionality.

Step 7d: Perform STA(Static Timing Analysis) with the SDF(Standard Delay Format) file and synthesized netlist file, to check whether the Design is meeting the timing-requirements.

Step 7e: Perform Scan-Tracing , in the DFT tool, to check whether the scan-chain is built based on the DFT requirement.

Step 8: Once the synthesis is performed the synthesized netlist file(VHDL/Verilog format) and the SDC (constraints file) is passed as input files to the Placement and Routing Tool to perform the back-end Actitivities.

Step 9: The next step is the Floor-planning, which means placing the IP's based on the connectivity,placing the memories, Create the Pad-ring, placing the Pads(Signal/power/transfer-cells(to switch voltage domains/Corner pads(proper accessibility for Package routing), meeting the SSN requirements(Simultaneous Switching Noise) that when the high-speed bus is switching that it doesn't create any noise related acitivities, creating an optimised floorplan, where the design meets the utilization targets of the chip.

Step 9a : Release the floor-planned information to the package team, to perform the package feasibility analysis for the pad-ring .

Step 9b: To the placement tool, rows are cut, blockages are created where the tool is prevented from placing the cells, then the physical placement of the cells is performed based on the timing/area requirements.The power-grid is built to meet the power-target's of the Chip .

Step 10: The next step is to perform the Routing., at first the Global routing and Detailed routing, meeting the DRC(Design Rule Check) requirement as per the fabrication requirement.

Step 11: After performing Routing then the routed Verilog netlist, standard-cells LEF/DEF file is taken to the Extraction tool (to extract the parasitics(RLC) values of the chip in the SPEF format(Standard parasitics Exchange Format), and the SPEF file is generated.

Step 12: Check whether the Design is meeting the requirements (Functional/Timing/Area/Power/DFT/DRC/LVS/ERC/ESD/SI/IR-Drop) after Placement and Routing step.

Step 12a: Perform the Routed Netlist-level Power Analysis, to know whether the design has met the power targets.

Step 12b: Perform Gate-level Simulation with the routed Netlist to check whether the design is meeting the functional requirement .

Step 12c: Perform Formal-verification between RTL vs routed Netlist to confirm that the place & route Tool has not altered the functionality.

Step 12d: Perform STA(Static Timing Analysis) with the SPEF file and routed netlist file, to check whether the Design is meeting the timing-requirements.

Step 12e: Perform Scan-Tracing , in the DFT tool, to check whether the scan-chain is built based on the DFT requirement, Peform the Fault-coverage with the DFT tool and Generate the ATPG test-vectors.

Step 12f: Convert the ATPG test-vector to a tester understandable format(WGL)

Step 12g: Perform DRC(Design Rule Check) verfication called as Physical-verification, to confirm that the design is meeting the Fabrication requirements.

Step 12h: Perform LVS(layout vs Spice) check, a part of the verification which takes a routed netlist converts to spice (call it SPICE-R) and convert the Synthesized netlist(call it SPICE-S) and compare that the two are matching.

Step 12i : Perform the ERC(Electrical Rule Checking) check, to know that the design is meeting the ERC requirement.

Step 12j: Perform the ESD Check, so that the proper back-to-back diodes are placed and proper guarding is there in case if we have both analog and digital portions in our Chip. We have separate Power and Grounds for both Digital and Analog Portions, to reduce the Substrate-noise.

Step 12k: Perform separate STA(Static Timing Analysis) , to verify that the Signal-integrity of our Chip. To perform this to the STA tool, the routed netlist and SPEF file(parasitics including coupling capacitances values), are fed to the tool. This check is important as the signal-integrity effect can cause cross-talk delay and cross-talk noise effects, and hinder in the functionality/timing aspects of the design.

Step 12l: Perform IR Drop analysis, that the Power-grid is so robust enough to with-stand the static and dynamic power-drops with in the design and the IR-drop is with-in the target limits.

Step 13: Once the routed design is verified for the design constraints, then now the next step is chip-finishing activities (like metal-slotting, placing de-coupling caps).

Step 14: Now the Chip Design is ready to go to the Fabrication unit, release files which the fab can understand, GDS file.

Step 15: After the GDS file is released , perform the LAPO check so that the database released to the fab is correct.

Step 16: Perform the Package wire-bonding, which connects the chip to the Package.

ii hAve nO iideA

List of Embedded System companies in Chennai

1. ACME Technology Pvt Ltd

2. Agnie Consulting(I) Pvt.Ltd

3. Alcatel-Lucent Chennai

4. American Mega Trends Pvt.Ltd

5. Ansaldo STS India Pvt. Ltd, Chennai

6. Apna Technologies

7. Appasamy Associate

8. Aricent Technologies

9. Arista Automation Pvt Ltd

10. Ashva Technologies Pvt Ltd

11. Atheros Communications

12. Atmel

A sweep generator is an instrument used to align IF circuits in older FM radios that used adjustable IF coils in the circuits. The generator "sweeps" the frequencies on either side of a set center frequency. When this signal is applied to the front end of an IF circuit, the responce from the IF circuit can be observed at the end of the IF with an oscilloscope allowing the IF coils in the circuit to be adjusted to the desired bandwidth and responce of the circuit.

BIOS refers to (Basic Input Output System) it is responsible for booting of your system while DOS(Disk Operating System) is an operating system that user uses by entering commands in command prompt(to open in windows press start+r).

{| ! CMOS ! TTL | CMOS has good packing density. TTL takes up more space CMOS has better noise immmunity. TTL has a smaller noise immunity range CMOS has a large fan out. TTL can power less inputs CMOS consume less power. TTL use more power CMOS are highly static sensitive. TTL IC's tend to be less susceptible to static electricity CMOS uses FETS (Field-Effect Transistors) TTL uses BJTs (Bipolar junction Transistors CMOS can run with a range of supply voltages. TTL IC's run with a 5V supply. CMOS uses Vdd and Vss for it's power connections TTL uses BJTs (Bipolar junction Transistors CMOS takes a lot less power and is therefore suitable for battery applications, but generally speaking can't run as fast. TTL devices can drive more power into a load. CMOS chips can be damaged by static electricity: even a static jolt that you or I can't feel might destroy a CMOS chip! |}

Transistor Transistor Logic. Main feature is cheap and old technology. Drawbacks it has limited speed and fan IN-OUT.

Depends on the types of logic gates you're drawing. They have different symbols. You should be able to search the web for a list of symbols for the various gate topology. Using smartdraw tool, you can drag and drop such ready made shapes.

Corel draw graphic suite is another such tool.

The NOT gate is also called an "inverter", as its output is always the complement of the input. That is, if the input is TRUE then the output is FALSE else the output is TRUE end if). Its implementation electronically is not much different than that of an analog inverting amplifier, except that the gate is deliberately designed to operate nonlinear and change rapidly from one state to another.