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Technology
The practical application of knowledge, especially in a particular area, is called technology. Advances in technology affect every area of our lives. This category is for questions about technology and includes everything from how to remove a scratch from a CD to applications of electronics to what polyester is made from and more.
35,090 Questions
What would life be without telescopes?
Without telescopes, our understanding of the universe would be limited to what we can observe with the naked eye. We would have a smaller understanding of the vastness of the cosmos, the nature of celestial bodies, and our place in the universe. Science and astronomy would be severely hindered without the ability to observe distant objects and phenomena.
How do you calculate space temperature?
The temperature of outer space is measured in Degrees Kelvin. The Kelvin scale starts at what is called Absolute Zero, and is based on the theory of a "Perfect Vaccuum" (a vaccuum in which no matter exists whatsoever). Space, however, is not a perfect vaccuum. There are various gasses and other particles floating around in it, and for that reason its temperature cannot possibly be Absolute Zero. It would depend on exactly how much matter is present in any given region of space as to that regions temperature in Degrees Kelvin. It is scientifically acceptable to determine the temperature of space to be "fractionally above Absolute Zero", as its (space, as a whole) temperature varies from region to region. How the temperature in space is physically measured is another question, and one I cannot answer.
Could people actually ever bring Titanic to the surface?
The titanic could be brought up to the surface and we do have the technology, but it would brake into pieces if we did. But i dont think anyone would be paying that great amount of money for taking the Titanic back to surface.
Definiion of universe of discourse?
The universe of discourse in logic and mathematics refers to the set of all objects or elements that are being considered in a particular discussion or situation. It establishes the context within which statements and variables are defined and evaluated. It helps to specify the range of possible values or entities that are relevant to the problem at hand.
How do you set a prospirit watch?
There are four buttons. The Light button just turns on the back-light.
Buttons Function
Light Back-light
S1 = Lap/Reset Display when alarm is set
S2 = St/Stop Display date
S3 = Mode Toggle time, stopwatch, alarm set, time set modes
Normal time mode
Hold S1+S2 Toggle alarm on/off
Hold S1+S3 Toggle hourly chime. If days displayed, chime is on, If no days displayed, chime is off
Hold S3+ S1 to select which hr, min, date to be blinking, then don't remove s3, relive s1 and press S2 to set the required value.
just go to "s3" the one where you can change from time to stopwatch ... and when the second thing is blinking press the "s2" which tells you the date
What is the middle thing on a compass called?
The middle thing on a compass is called the compass rose. It is the circular marking that shows the cardinal directions (north, south, east, west) and sometimes intermediate points on a map or compass.
Where is solar energy obtained from?
Solar refers to the sun as in our solar system. Solar energy is energy obtained from the sun. It may be just energy that is collected as heat such as what collects in a closed room from passing through windows or it may be energy that is collected by solar cells and converted by them to electricity. This electricity is usually then stored in wet cell batteries for later use as direct current or further conversion to alternating current to be used with household or other appliances.
Technological and scientific advances to allow us to better study space?
Throughout the years, many scientific advances have been made in space. These advances have saved lives and made difficult tasks simpler. Adjustable smoke detectors, ultrasound scanners and firefighter breathing systems are just a few of the quite useful inventions using space technology. There are many benefits of these scientific advances. Adjustable smoke detectors benefit humans in many ways. They were invented by Skylab, the first American space station. The scientists at Skylab wanted to be notified if any harmful chemicals were loose in the building. They teamed up with Honeywell to create the first adjustable smoke detector. Smoke detectors save many lives each year. Homes with smoke detectors have a death rate of 40-50% less than homes unequipped. The homes with smoke detectors benefit greatly. The adjustable smoke detector is one of the most efficient scientific advances. The ultrasound scanner is one of the most important advances in modern technology. It was invented in 1961 by Ian Donald. An ultrasound uses sound waves to create a picture of the body. A microphone is passed over the patient's body. The sound waves reflect off of the organs and are picked up again by the microphone. The microphone is connected to a computer which turns the reflected sound into a picture. Ultrasounds can help detect kidney stones and tumours. By knowing about the presence of a tumour, doctors can remove it. The ultrasound scanner saves many lives. Firefighter breathing systems are another excellent example of an important scientific advance. In the 1970's, NASA began working to improve the breathing systems. They weighed about 60 lbs, and had hardly changed since the 1940's. The Johnson's space and flight center conducted a four year program to improve the breathing systems. The program involved technology from space suits used in space. The new system now weighs under 20 lbs, and is strapped onto the firefighter so that it applies pressure to the hips, and not the shoulders. The new breathing system rapidly spread across the country and reduced the amount of injuries caused by smoke and fumes drastically. The new breathing system has helped firefighters save many lives. Throughout the years, many scientific advances have been made in space. These advances have saved lives and made difficult tasks simpler. Adjustable smoke detectors, ultrasound scanners and firefighter breathing systems are just a few of the quite useful inventions using space technology. There are many benefits of these scientific advances. Adjustable smoke detectors benefit humans in many ways. They were invented by Skylab, the first American space station. The scientists at Skylab wanted to be notified if any harmful chemicals were loose in the building. They teamed up with Honeywell to create the first adjustable smoke detector. Smoke detectors save many lives each year. Homes with smoke detectors have a death rate of 40-50% less than homes unequipped. The homes with smoke detectors benefit greatly. The adjustable smoke detector is one of the most efficient scientific advances. The ultrasound scanner is one of the most important advances in modern technology. It was invented in 1961 by Ian Donald. An ultrasound uses sound waves to create a picture of the body. A microphone is passed over the patient's body. The sound waves reflect off of the organs and are picked up again by the microphone. The microphone is connected to a computer which turns the reflected sound into a picture. Ultrasounds can help detect kidney stones and tumours. By knowing about the presence of a tumour, doctors can remove it. The ultrasound scanner saves many lives. Firefighter breathing systems are another excellent example of an important scientific advance. In the 1970's, NASA began working to improve the breathing systems. They weighed about 60 lbs, and had hardly changed since the 1940's. The Johnson's space and flight center conducted a four year program to improve the breathing systems. The program involved technology from space suits used in space. The new system now weighs under 20 lbs, and is strapped onto the firefighter so that it applies pressure to the hips, and not the shoulders. The new breathing system rapidly spread across the country and reduced the amount of injuries caused by smoke and fumes drastically. The new breathing system has helped firefighters save many lives. Throughout the years, many scientific advances have been made in space. These advances have saved lives and made difficult tasks simpler. Adjustable smoke detectors, ultrasound scanners and firefighter breathing systems are just a few of the quite useful inventions using space technology. There are many benefits of these scientific advances. Adjustable smoke detectors benefit humans in many ways. They were invented by Skylab, the first American space station. The scientists at Skylab wanted to be notified if any harmful chemicals were loose in the building. They teamed up with Honeywell to create the first adjustable smoke detector. Smoke detectors save many lives each year. Homes with smoke detectors have a death rate of 40-50% less than homes unequipped. The homes with smoke detectors benefit greatly. The adjustable smoke detector is one of the most efficient scientific advances. The ultrasound scanner is one of the most important advances in modern technology. It was invented in 1961 by Ian Donald. An ultrasound uses sound waves to create a picture of the body. A microphone is passed over the patient's body. The sound waves reflect off of the organs and are picked up again by the microphone. The microphone is connected to a computer which turns the reflected sound into a picture. Ultrasounds can help detect kidney stones and tumours. By knowing about the presence of a tumour, doctors can remove it. The ultrasound scanner saves many lives. Firefighter breathing systems are another excellent example of an important scientific advance. In the 1970's, NASA began working to improve the breathing systems. They weighed about 60 lbs, and had hardly changed since the 1940's. The Johnson's space and flight center conducted a four year program to improve the breathing systems. The program involved technology from space suits used in space. The new system now weighs under 20 lbs, and is strapped onto the firefighter so that it applies pressure to the hips, and not the shoulders. The new breathing system rapidly spread across the country and reduced the amount of injuries caused by smoke and fumes drastically. The new breathing system has helped firefighters save many lives.
What technology was used to detect hurricane Ivan?
As with all other modern hurricanes, different types of satellite sensors were used most extensively. Planes were also flown through the storm to observe it directly, and radars have limited utility when the hurricane came within their range on the ground.
What is in space if space isn't there?
Space is the vast expanse that exists between objects in the universe. It is not defined by physical matter or objects but rather as the area where these objects exist. If space were not there, there would be no distance between celestial bodies, and the universe would be a singular point with no separation between objects.
How do objects in space move around other objects in space?
Objects in space move around other objects due to gravitational forces. These forces cause objects to orbit around a more massive body, like planets around a star, based on their mass and distance. The path an object follows is known as an orbit and is determined by a balance between the object's velocity and the gravitational pull of the larger body.
The first working laser was demonstrated by Theodore Maiman at Hughes Research Labs on May 16th, 1960.
What are the various zones of a candle flame?
The various zones of a candle flame are the dark zone, the blue zone (inner cone), the luminous zone (middle zone), and the non-luminous zone (outer zone). In the dark zone, the wick is vaporized and breaks down into fuel molecules. The blue zone is where complete combustion occurs due to a sufficient oxygen supply, while the luminous zone emits light due to incomplete combustion of fuel. The non-luminous zone consists of unburned fuel and soot particles.
Why is the sun orange when it rises but not when it sets?
The apparent colour of the sun is mainly due to the atmospheric conditions and the amount of atmosphere the sun has to shine through. When low, it is shining to a larger amount of atmosphere. Stars near the horizon can vary in apparent colour and flicker more.
To obtain the maximum work/time (power) from two bodies at different
temperatures, you have to put an "Ideal" Heat Engine between the two
bodies. The Heat Engine works with the "Carnot Thermodynamic Cycle".
The Heat Efficiency of the Carnot Cycle Engine is called "Carnot Efficiency"
and it only depends on the Absolute Temperature of the two bodies.
Absolute Temperature also known as Thermodynamic Temperature
will be in Rankine degrees, oR, (U.S.C.S.), or Kelvins (I.S.).
The Carnot Heat efficiency is given by; eff (%) = [1 - TL/TH] x 100
where TH and TL are the High and Low Thermodynamic Temperatures of the
bodies.
So if a given Carnot Efficiency turns out be of 35%, this means that from
the heat given by the High Temperature body, 35% is converted to work
and the rest is dumped to the Low Temperature body.
Where on the disk should you put your boot partition?
Well when you partition your drive it will choose where you just put what size you want it to be.
(Unless: you are using a partitioning program i am not farmiliar with) I recommend using the puppy partitioner on puppy Linux Dingo
Yeah Osram Sylvania is one brand, but Sylvania is also dealing with Havells which is known as havells Sylvania & according to the market survey Havellls Sylvania is having a strong Platform in market these days as compare to Osram Sylvania.
Couple of days back I was reading an article in electronics magazine about the same comparison there they discussed about the Phillips, GE and Havells Sylvania and at the end of article it was declared that Havells Sylvania is the top brand among these three. Hope its the answer of your question.
What is the energy of a wavelength that is 500 nm?
The energy of a wavelength is given by the equation E = hc/λ, where h is Planck's constant, c is the speed of light, and λ is the wavelength. Plugging in the values, the energy of a 500 nm wavelength is approximately 3.97 x 10^-19 Joules.
What kind of material makes up a mirror?
Mirrors are made of a thin layer of metal (such as aluminum or silver) that is deposited on a glass surface. This metal layer reflects light to create a clear, reflective surface.
How does newtons law applied in rockets?
Newton's third law of motion states that for every action, there is an equal and opposite reaction. In rockets, this law is applied through the expulsion of hot gases out of the rocket engine nozzle, which creates a force pushing the rocket in the opposite direction. This reaction force propels the rocket forward, allowing it to overcome the force of gravity and travel through space.
What percentage of each metal is used to make solder?
CompositionSnPbAgCuSbBiInZnCdAuoth.M.p. °C
S/LToxicEutecticCommentsPb98Sn2298
316/322[11]PbnoNon-critical sealing and joining. Body solder.Pb97Sn3397
314/320[12]PbnoSn3[12]Pb96Sn4496
299/310[11]PbnoUsed for coating steel and copper, to provide resistance against mild acids and seawater.Pb95Sn5595
308/312[13] 301/314[4]PbnoSn5, UNS L54320, ASTM5A, ASTM5B, Indalloy 171.[14] Low cost and good bonding properties. Used for coating steel and copper. Used in both SMT (Surface-mount technology) and through-hole electronics. Rapidly dissolves gold and silver, not recommended for those.[15] useful for high-temperature service and step soldering. Remains ductile at very low temperatures, can be used for parts subject to vibration at cryogenic applications. Pb93.5Sn5Ag1.5 provides superior wetting and better strength.[16]Pb93Sn7793
288/308[11]PbnoUsed for coating steel to provide corrosion resistance, allows subsequent soldering.Pb90Sn101090
268/302[13] 275/302[12]PbnoSn10, UNS L54520, ASTM10B, Indalloy 159. Balls for CBGA components, replaced by SnAg3.9Cu0.6.[9] Low cost and good bonding properties. Rapidly dissolves gold and silver, not recommended for those.[15] Used for fabrication of car radiators and fuel tanks, for coating and bonding of metals for moderate service temperatures. Body solder.[11] Has low thermal EMF, can be used as an alternative to Cd70 where parasitic thermocouple voltage has to be avoided.[17]Pb88Sn121288
254/296[11]PbnoUsed for fabrication of car radiators and fuel tanks, for coating and bonding of metals for moderate service temperatures. Body solder.Pb85Sn151585
227/288[11]PbnoUsed for coating tubes and sheets and fabrication of car radiators. Body solder.Pb80Sn202080
183/280[12]PbnoSn20, UNS L54711. Used for coating radiator tubes for joining fins.[11]Pb75Sn252575
183/266[13]PbnoCrude solder for construction plumbing works, flame-melted. Used for soldering car engine radiators. Used for machine, dip and hand soldering of plumbing fixtures and fittings. Superior body solder.[11]Pb70Sn303070
185/255[13] 183/257[12]PbnoSn30, UNS L54280, crude solder for construction plumbing works, flame-melted, good for machine and torch soldering.[18] Used for soldering car engine radiators. Used for machine, dip and hand soldering of plumbing fixtures and fittings. Superior body solder.[11]Pb68Sn323268
253Pbno"Plumber solder", for construction plumbing works[19]Pb68Sn30Sb23068
2
185/243[12]PbnoPb68Pb67Sn333367
187-230PbnoPM 33, crude solder for construction plumbing works, flame-melted, temperature depends on additivesPb65Sn353565
183/250[12]PbnoSn35. Used as a cheaper alternative of Sn60Pb40 for wiping and sweating joints.[11]Pb60Sn404060
183/238[13] 183/247[12]PbnoSn40, UNS L54915,. For soldering of brass and car radiators.[18] For bulk soldering, and where wider melting point range is desired. For joining cables. For wiping and joining lead pipes. For repairs of radiators and electrical systems.[11]Pb55Sn454555
183/227[11]PbnoFor soldering radiator cores, roof seams, and for decorative joints.Sn50Pb505050
183/216[13] 183-212[12]PbnoSn50, UNS L55030,. "Ordinary solder", for soldering of brass, electricity meters, gas meters, formerly also tin cans. General purpose, for standard tinning and sheetmetal work. Becomes brittle below −150 °C.[10][19] Low cost and good bonding properties. Rapidly dissolves gold and silver, not recommended for those.[15] For wiping and assembling plumbing joints for non-potable water.[11]Sn50Pb49Cu15049
1
183/215[12]PbnoCu1Sn50Pb48.5Cu1.55048.5
1.5
183/215[20]PbnoSavbit, Savbit 1, Sav1. Minimizes dissolution of copper. Originally designed to reduce erosion of the soldering iron tips. About 100 times slower erosion of copper than ordinary tin/lead alloys. Suitable for soldering thin copper platings and very thin copper wires.[16]Sn60Pb406040
183/190[13] 183/188[12]PbnearSn60, ASTM60A, ASTM60B. Common in electronics, most popular leaded alloy for dipping. Low cost and good bonding properties. Used in both SMT and through-hole electronics. Rapidly dissolves gold and silver, not recommended for those.[15] Slightly cheaper than Sn63Pb37, often used instead for cost reasons as the melting point difference is insignificant in practice. On slow cooling gives slightly duller joints than Sn63Pb37.[16]Sn60Pb38Cu26038
2
183/190[12][21]Pb
Cu2. Copper content increases hardness of the alloy and inhibits dissolution of soldering iron tips and part leads in molten solder.Sn60Pb39Cu16039
1
Pbno
Sn62Pb386238
183Pbnear"Tin man's solder"[19]Sn63Pb376337
182 183[22]PbyesSn63, ASTM63A, ASTM63B. Common in electronics; exceptional tinning and wetting properties, also good for stainless steel. One of most common solders. Low cost and good bonding properties. Used in both SMT and through-hole electronics. Rapidly dissolves gold and silver, not recommended for those.[15] Sn60Pb40 is slightly cheaper and is often used instead for cost reasons, as the melting point difference is insignificant in practice. On slow cooling gives slightly brighter joints than Sn60Pb40.[16]Sn63Pb37P0.0015-0.046337
P183[23]PbyesSn63PbP. A special alloy for HASL machines. Addition of phosphorus reduces oxidation. Unsuitable for wave soldering as it may form metal foam.Sn62Pb37Cu16237
1
183[21]PbyesSimilar to Sn63Pb37. Copper content increases hardness of the alloy and inhibits dissolution of soldering iron tips and part leads in molten solder.Sn70Pb307030
183/193[13]PbnoSn70Sn90Pb109010
183/213[12]Pbnoformerly used for joints in food industrySn95Pb5955
238Pbnoplumbing and heatingPb92Sn5.5Ag2.55.5922.5
286/301[21]PbnoFor higher-temperature applications.Pb80Sn12Sb81280
8
PbnoUsed for soldering iron and steel[19]Pb80Sn18Ag218802
252/260[12]PbnoUsed for soldering iron and steel[19]Pb79Sn20Sb12079
1
184/270PbnoSb1Pb55Sn43.5Sb1.543.555
1.5
PbnoGeneral purpose solder. Antimony content improves mechanical properties but causes brittleness when soldering cadmium, zinc, or galvanized metals.[19]Sn43Pb43Bi144343
14
144/163[13]PbnoBi14, Indalloy 97. Good fatigue resistance combined with low melting point. Contains phases of tin and lead-bismuth.[24] Useful for step soldering.Sn46Pb46Bi84646
8
120/167[12]PbnoBi8Bi52Pb32Sn161632
52
96Pbyes?Bi52. Good fatigue resistance combined with low melting point. Reasonable shear strength and fatigue properties. Combination with lead-tin solder may dramatically lower melting point and lead to joint failure.[24]Bi46Sn34Pb203420
46
100/105[12]PbnoBi46Sn62Pb36Ag262362
179[13]PbyesSn62. Common in electronics. The strongest tin-lead solder. Appearance identical to Sn60Pb40 or Sn63Pb37. Crystals of Ag3Sn may be seen growing from the solder. Extended heat treatment leads to formation of crystals of binary alloys. Silver content decreases solubility of silver, making the alloy suitable for soldering silver-metallized surfaces, e.g. SMD capacitors and other silver-metallized ceramics.[10][16][24] Not recommended for gold.[15] General-purpose.Sn62.5Pb36Ag2.562.5362.5
179[13]Pbyes
Pb88Sn10Ag210882
268/290[13] 267/299[25]PbnoSn10, Pb88, Indalloy 228. Silver content reduces solubility of silver coatings in the solder. Not recommended for gold.[15] Forms a eutectic phase, not recommended for operation above 120 °C.Pb90Sn5Ag55905
292[13]Pbyes
Pb92.5Sn5Ag2.5592.52.5
287/296[13] 299/304[12]PbnoPb93, Indalloy 151. Similar to Indalloy 165.Pb93.5Sn5Ag1.5593.51.5
296/301[13] 305/306[12]PbnoPb94, HMP alloy, HMP. Service temperatures up to 255 °C. Useful for step soldering. Also can be used for extremely low temperatures as it remains ductile down to −200 °C, while solders with more than 20% tin become brittle below −70 °C. Higher strength and better wetting than Pb95Sn5.[16]Pb95.5Sn2Ag2.5295.52.5
299/304[13]Pbno
In97Ag3
3
97
143[26]-yesIndalloy 290. Wettability and low-temperature malleability of indium, strength improved by addition of silver. Particularly good for cryogenic applications. Used for packaging of photonic devices.In90Ag10
10
90
143/237[27]-noIndalloy 3. Nearly as wettable and low-temperature malleable as indium. Large plastic range. Can solder silver, fired glass and ceramics.In75Pb25
25
75
156/165[15]PbnoLess gold dissolution and more ductile than lead-tin alloys. Used for die attachment, general circuit assembly and packaging closures.[15]In70Pb30
30
70
160/174[13] 165/175[12][28]PbnoIn70, Indalloy 204. Suitable for gold, low gold-leaching. Good thermal fatigue properties.In60Pb40
40
60
174/185[13] 173/181[12]PbnoIn60, Indalloy 205. Low gold-leaching. Good thermal fatigue properties.In50Pb50
50
50
180/209[15] 178/210[12]PbnoIn50, Indalloy 7. Only one phase. Resoldering with lead-tin solder forms indium-tin and indium-lead phases and leads to formation of cracks between the phases, joint weakening and failure.[24] On gold surfaces gold-indium intermetallics tend to be formed, and the joint then fails in the gold-depleted zone and the gold-rich intermetallic.[29] Less gold dissolution and more ductile than lead-tin alloys.[15] Good thermal fatigue properties.In50Sn5050
50
118/125[30]-noIndalloy 1, Cerroseal 35. Fairly well wets glass, quartz and many ceramics. Malleable, can compensate some thermal expansion differences. Low vapor pressure. Used in low temperature physics as a glass-wetting solder.[31]In70Sn15Pb9.6Cd5.4159.6
70
5.4
125[32]Pb,Cd
Indalloy 13Pb75In25
75
25
250/264[15] 240/260[33]PbnoIn25, Indalloy 10. Low gold-leaching. Good thermal fatigue properties. Used for die attachment of e.g. GaAs dies.[29] Used also for general circuit assembly and packaging closures. Less dissolution of gold and more ductile than tin-lead alloy.[15]Sn70Pb18In127018
12
162[13]
154/167[34]PbyesIndalloy 9. General purpose. Good physical properties.Sn37.5Pb37.5In2537.537.5
25
134/181[15]PbnoGood wettability. Not recommended for gold.[15]Pb90In5Ag5
905
5
290/310[13]Pbno
Pb92.5In5Ag2.5
92.52.5
5
300/310[13]PbnoUNS L51510, Indalloy 164. Minimal leaching of gold, good thermal fatigue properties. Reducing atmosphere frequently used..Pb92.5In5Au2.5
92.5
5
2.5
300/310[12]PbnoIn5Pb94.5Ag5.5
94.55.5
305/364[12] 304/343[35]PbnoAg5.5, UNS L50180, Indalloy 229Pb95Ag5
955
305/364[36]PbnoIndalloy 175Pb97.5Ag2.5
97.52.5
303[13] 304[12] 304/579[37]Pbyes noAg2.5, UNS L50132, Indalloy 161. Used during World War II to conserve tin. Poor corrosion resistance; joints suffered corrosion in both atmospheric and underground conditions, all had to be replaced with Sn-Pb alloy joints.[38] Torch solder.Sn97.5Pb1Ag1.597.511.5
305PbyesImportant for hybrid circuits assembly.[10]Pb97.5Ag1.5Sn1197.51.5
309[13]PbyesAg1.5, ASTM1.5S, Indalloy 165. High melting point, used for commutators, armatures, and initial solder joints where remelting when working on nearby joints is undesirable.[18] Silver content reduces solubility of silver coatings in molten solder. Not recommended for gold.[15] Standard PbAgSn eutectic solder, wide use in semiconductor assembly. Reducing protective atmosphere (e.g. 12% hydrogen) often used. High creep resistance, for use at both elevated and cryogenic temperatures.Pb54Sn45Ag145541
177-210Pb
exceptional strength, silver gives it a bright long-lasting finish; ideal for stainless steel[18]Pb96Ag4
964
305Pb
high-temperature joints[18]Pb96Sn2Ag22962
252/295[12]Pb
Pb96Sn61Pb36Ag361363
Pb
[10]Sn56Pb39Ag556395
Pb
[10]Sn98Ag298
2
-
[10]Sn65Ag25Sb1065
25
10
233-yesIndalloy 209. Very high tensile strength. For die attachment. Very brittle. Old Motorola die attach solder.Sn96.5Ag3.0Cu0.596.5
30.5
217/220 217/218[12][39]-nearSAC305, Indalloy 256, SN97C. Predominantly used in Japan. It is the JEITA recommended alloy for wave and reflow soldering, with alternatives SnCu for wave and SnAg and SnZnBi for reflow soldering. Usable also for selective soldering and dip soldering. At high temperatures tends to dissolve copper; copper buildup in the bath has detrimental effect (e.g. increased bridging). Copper content must be maintained between 0.4-0.85%, e.g. by refilling the bath with Sn97Ag3 alloy (designated e.g. SN97Ce). Nitrogen atmosphere can be used to reduce losses by dross formation. Dull, surface shows formation of dendritic tin crystals.Sn95.8Ag3.5Cu0.795.8
3.50.7
217-218-nearSN96C-Ag3.5 A commonly used alloy. Used for wave soldering. Usable also for selective soldering and dip soldering. At high temperatures tends to dissolve copper; copper buildup in the bath has detrimental effect (e.g. increased bridging). Copper content must be maintained between 0.4-0.85%, e.g. by refilling the bath with Sn96.5Ag3.5 alloy (designated e.g. SN96Ce). Nitrogen atmosphere can be used to reduce losses by dross formation. Dull, surface shows formation of dendritic tin crystals.Sn95.6Ag3.5Cu0.995.6
3.50.9
217-yesDetermined by NIST to be truly eutectic.Sn95.5Ag3.8Cu0.795.5
3.80.7
217[40]-almostSN96C. Preferred by the European IDEALS consortium for reflow soldering. Usable also for selective soldering and dip soldering. At high temperatures tends to dissolve copper; copper buildup in the bath has detrimental effect (e.g. increased bridging). Copper content must be maintained between 0.4-0.85%, e.g. by refilling the bath with Sn96.2Ag3.8 alloy (designated e.g. SN96Ce). Nitrogen atmosphere can be used to reduce losses by dross formation. Dull, surface shows formation of dendritic tin crystals.Sn95.25Ag3.8Cu0.7Sb0.2595.25
3.80.70.25
-
Preferred by the European IDEALS consortium for wave soldering.Sn95.5Ag3.9Cu0.695.5
3.90.6
217[41]-yesIndalloy 252. Recommended by the US NEMI consortium for reflow soldering. Used as balls for BGA/CSP and CBGA components, a replacement for Sn10Pb90. Solder paste for rework of BGA boards.[9] Alloy of choice for general SMT assembly.Sn95.5Ag4Cu0.595.5
40.5
217[42]-yesIndalloy 246. Prior-art use makes it patent-free.Sn96.5Ag3.596.5
3.5
221[13]-yesSn96, Sn96.5, 96S, Indalloy 121. Fine lamellar structure of densely distributed Ag3Sn. Annealing at 125 °C coarsens the structure and softens the solder.[9] Creeps via dislocation climb as a result of lattice diffusion.[8] Used as wire for hand soldering rework; compatible with SnCu0.7, SnAg3Cu0.5, SnAg3.9Cu0.6, and similar alloys. Used as solder spheres for BGA/CSP components. Used for step soldering and die attachment in high power devices. Established history in the industry.[9] Widely used. Strong lead-free joints. Silver content minimizes solubility of silver coatings. Not recommended for gold.[15] Marginal wetting. Good for step soldering. Used for soldering stainless steel as it wets stainless steel better than other soft solders. Silver content does not suppress dissolution of silver metallizations.[16] High tin content allows absorbing significant amount of gold without embrittlement.[43]Sn96Ag496
4
221-229-noASTM96TS. "Silver-bearing solder". Food service equipment, refrigeration, heating, air conditioning, plumbing.[18] Widely used. Strong lead-free joints. Silver content minimizes solubility of silver coatings. Not recommended for gold.[15]Sn95Ag595
5
221/240[15]-noSn95. Widely used. Strong lead-free joints. Silver content minimizes solubility of silver coatings. Not recommended for gold.[15]Sn95Ag4Cu195
41
-
Sn99.99
232-pureSn99. Good strength, non-dulling. Use in food processing equipment, wire tinning, and alloying.[18] Susceptible to tin pest.Sn99.3Cu0.799.3
0.7
(Ni)227-yesIndalloy 244, Sn99Cu1. Also designated as Sn99Cu1. Cheap alternative for wave soldering, recommended by the US NEMI consortium. Coarse microstructure with ductile fractures. Sparsely distributed Cu6Sn5.[44] Forms large dendritic β-tin crystals in a network of eutectic microstructure with finely dispersed Cu6Sn5. High melting point unfavorable for SMT use. Low strength, high ductility. Susceptible to tin pest.[8] Addition of small amount of nickel increases its fluidity; the highest increase occurs at 0.06% Ni. Such alloys are known as nickel modifiedor nickel stabilized.[45] An example with 0.05% Ni is designated SN100C. The properties degrade with dissolved copper; at above 0.85% the alloy tends to form bridges between part leads. At above 0.9% Cu needles of copper-tin intermetallic precipitate and settle at the bottom of the solder bath. The alloy attacks steel less than the tin-silver-copper alloys, allowing use of stainless steel solder pots. Slower wetting than Sn63Pb37.[46]Sn99Cu0.7Ag0.399
0.30.7
217/228[47]-noSCA, SAC, or SnAgCu. Tin-silver-copper alloy. Relatively low-cost lead-free alloy for simple applications. Can be used for wave, selective and dip soldering. At high temperatures tends to dissolve copper; copper buildup in the bath has detrimental effect (e.g. increased bridging). Copper content must be maintained between 0.4-0.85%, e.g. by refilling the bath with Sn96.2Ag3.8 alloy (designated e.g. SN96Ce). Nitrogen atmosphere can be used to reduce losses by dross formation. Dull, surface shows formation of dendritic tin crystals.Sn97Cu397
3
227/250[48] 232/332[11]-
For high-temperature uses. Allows removing insulation from an enameled wire and applying solder coating in a single operation. For radiator repairs, stained glass windows, and potable water plumbing.Sn97Cu2.75Ag0.2597
0.252.75
228/314[11]-
High hardness, creep-resistant. For radiators, stained glass windows, and potable water plumbing. Excellent high-strength solder for radiator repairs. Wide range of patina and colors.Zn100
100
419-pureFor soldering aluminium. Good wettability of aluminium, relatively good corrosion resistance.[49]Bi100
100
271-pureUsed as a non-superconducting solder in low-temperature physics. Does not wet metals well, forms a mechanically weak joint.[31]Sn91Zn991
9
199-yesIndalloy 201. Cheaper alloy, prone to corrosion and oxidation. Recommended for soldering aluminium.[19] Fair wetting of aluminium, fair corrosion rating.[38] Room temperature tensile strength twice of SnPb37. High drossing. Solder paste has short shelf-life.Zn95Al5
95
Al5382-yesFor soldering aluminium. Good wetting.[49]Sn91.8Bi4.8Ag3.491.8
3.4
4.8
211/213[50]-noIndalloy 249. Do not use on lead-containing metallizations. U.S. Patent 5,439,639 (ICA Licensed Sandia Patent).Sn70Zn3070
30
199/311-noFor soldering of aluminium. Good wetting.[38]Pb63Sn35Sb23563
2
185/243[12]PbnoSb2Pb63Sn34Zn33463
3
170/256PbnoPoor wetting of aluminium. Poor corrosion rating.[38]Pb92Cd8
92
8
310?Pb,Cd?For soldering aluminium. US patent 1,333,666.[51]Sn48Bi32Pb204820
32
140/160[21]PbnoFor low-temperature soldering of heat-sensitive parts, and for soldering in the vicinity of already soldered joints without their remelting.Sn89Zn8Bi389
3
8
191-198-
Prone to corrosion and oxidation due to its zinc content. On copper surfaces forms a brittle Cu-Zn intermetallic layer, reducing the fatigue resistance of the joint; nickel plating of copper inhibits this.[52]Sn83.6Zn7.6In8.883.6
8.87.6
181/187[53]-noIndalloy 226. High dross due to zinc. Covered by U.S. Patent #5,242,658.Sn86.5Zn5.5In4.5Bi3.586.5
3.54.55.5
174/186[54]-noIndalloy 231. Lead-free. Corrosion concerns and high drossing due to zinc content.Sn86.9In10Ag3.186.9
3.1
10
204/205[55]-
Indalloy 254. Potential use in flip-chip assembly, no issues with tin-indium eutectic phase.Sn95Ag3.5Zn1Cu0.595
3.50.5
1
221L[52]-no
Sn95Sb595
5
235/240[13] 232/240[12]-noSb5, ASTM95TA, Indalloy 133. The US plumbing industry standard. It displays good resistance to thermal fatigue and good shear strength. Forms coarse dendrites of tin-rich solid solution with SbSn intermetallic dispersed between. Very high room-temperature ductility. Creeps via viscous glide of dislocations by pipe diffusion. More creep-resistant than SnAg3.5. Antimony can be toxic. Used for sealing chip packagings, attaching I/O pins to ceramic substrates, and die attachment; a possible lower-temperature replacement of AuSn.[8] High strength and bright finish. Use in air conditioning, refrigeration, some food containers, and high-temperature applications.[18] Good wettability, good long-term shear strength at 100 °C. Suitable for potable water systems. Used for stained glass, plumbing, and radiator repairs.Sn97Sb397
3
232/238[56]-noIndalloy 131Sn99Sb199
1
232/235[57]-noIndalloy 129Sn99Ag0.3Cu0.799
0.30.7
-
Sn96.2Ag2.5Cu0.8Sb0.596.2
2.50.80.5
217-225 217[12]-
Ag03A. Patented by AIM alliance.Sn88In8.0Ag3.5Bi0.588
3.5
0.58
197-208-
Patented by Matsushita/Panasonic.Bi57Sn42Ag142
1
57
137/139 139/140[58]-
Indalloy 282. Addition of silver improves mechanical strength. Established history of use. Good thermal fatigue performance. Patented by Motorola.Bi58Sn4242
58
138[13][15]-yesBi58, Indalloy 281, Indalloy 138, Cerrothru. Reasonable shear strength and fatigue properties. Combination with lead-tin solder may dramatically lower melting point and lead to joint failure.[24] Low-temperature eutectic solder with high strength.[15] Particularly strong, very brittle.[13] Used extensively in through-hole technology assemblies in IBM mainframe computers where low soldering temperature was required. Can be used as a coating of copper particles to facilitate their bonding under pressure/heat and creating a conductive metallurgical joint.[52] Sensitive to shear rate. Good for electronics. Used in thermoelectric applications. Good thermal fatigue performance.[59] Established history of use. Expands slightly on casting, then undergoes very low further shrinkage or expansion, unlike many other low-temperature alloys which continue changing dimensions for some hours after solidification.[31]Bi58Pb42
42
58
124/126[60]Pb
Indalloy 67In80Pb15Ag5
155
80
142/149[12]
149/154[61]PbnoIn80, Indalloy 2. Compatible with gold, minimum gold-leaching. Resistant to thermal fatigue. Can be used in step soldering.Pb60In40
60
40
195/225[12]PbnoIn40, Indalloy 206. Low gold-leaching. Good thermal fatigue properties.Pb70In30
70
30
245/260[12]PbnoIn30Sn37.5Pb37.5In2637.537.5
26
134/181[12]PbnoIn26Sn54Pb26In205426
20
130/154[12] 140/152[62]PbnoIn20, Indalloy 532Pb81In19
81
19
270/280[12] 260/275[63]PbnoIn19, Indalloy 150. Low gold-leaching. Good thermal fatigue properties.In52Sn4848
52
118-yesIn52, Indalloy 1E. Suitable for the cases where low-temperature soldering is needed. Can be used for glass sealing.[52] Sharp melting point. Good wettability of glass, quartz, and many ceramics. Good low-temperature malleability, can compensate for different thermal expansion coefficients of joined materials.Sn52In4852
48
118/131[13]-novery low tensile strengthSn58In4258
42
118/145[64]-noIndalloy 87Sn51.2Pb30.6Cd18.251.230.6
18.2
145[65]Pb,CdyesIndalloy 181. General-purpose. Maintains creep strength well. Unsuitable for gold.Sn77.2In20Ag2.877.2
2.8
20
175/187[66]-noIndalloy 227. Similar mechanical properties with Sn63Pb37, Sn62Pb36Ag2 and Sn60Pb40, suitable lead-free replacement. Contains eutectic Sn-In phase with melting point at 118 °C, avoid use above 100 °C.In74Cd26
74
26
123[67]CdyesIndalloy 253.In61.7Bi30.8Cd7.5
30.861.7
7.5
62[68]CdyesIndalloy 18Bi47.5Pb25.4Sn12.6Cd9.5In512.625.4
47.55
9.5
57/65[69]Pb,CdnoIndalloy 140Bi48Pb25.4Sn12.8Cd9.6In412.825.4
48
9.6
61/65[70]Pb,CdnoIndalloy 147Bi49Pb18Sn15In181518
4918
58/69[71]PbnoIndalloy 21Bi49Pb18Sn12In211218
4921
58PbyesCerrolow 136. Slightly expands on cooling, later shows slight shrinkage in couple hours afterwards. Used as a solder in low-temperature physics.[31]Bi50.5Pb27.8Sn12.4Cd9.312.427.8
50.5
9.3
70/73[72]Pb,CdnoIndalloy 22Bi50Pb26.7Sn13.3Cd1013.326.7
50
10
70Pb,CdyesCerrobend. Used in low-temperature physics as a solder.[31]Bi44.7Pb22.6In19.1Cd5.3Sn8.38.322.6
44.719.1
5.3
47Cd,PbyesIndalloy 117, Cerrolow 117. Used as a solder in low-temperature physics.[31]In60Sn4040
60
113/122[13]-no
In51.0Bi32.5Sn16.516.5
32.551
60.5-yesField's metalBi49.5Pb27.3Sn13.1Cd10.113.127.3
49.5
10.1
70.9Pb,CdyesLipowitz MetalBi50.0Pb25.0Sn12.5Cd12.512.525
50
12.5
71Pb,CdyesWood's metal, mostly used for casting.Bi50.0Pb31.2Sn18.818.831.2
50
97PbnoNewton's metalBi50Pb28Sn222228
50
109PbnoRose's metal. It was used to secure cast iron railings and balusters in pockets in stone bases and steps. Does not contract on cooling.Cd95Ag5
5
95
338/393
340/395[73]Cd
Indalloy 185. melts at 338 °C, flows at 393 °C; for high-temperature applications, for soldering aluminium to itself or to other metals.[19] Braze 053. For medium-strength joints. For low-temperature brazing.Cd82.5Zn17.5
17.582.5
265Cd
For soldering aluminium and die-cast zinc alloys.[19] Used in cryogenic physics for ataching electrical potential leads to specimens of metals, as this alloy does not become superconductive at liquid helium temperatures.[31]Zn90Cd10
9010
265/399Cd
For soldering aluminium. Good wetting.[49]Zn60Cd40
6040
265/335Cd
For soldering aluminium. Very good wetting.[49]Cd70Sn3029.56
70.44
140/160[12]CdnoCd70, thermal-free solder. Produces low thermal EMF joints in copper, does not form parasitic thermocouples. Used in low-temperature physics.[31]Sn50Pb32Cd185032
18
145[12]Cd,Pb
Cd18Sn40Pb42Cd184042
18
145[74]Cd,Pb
LT145. Low melting temperature allows repairing pewter and zinc objects, including die-cast toys.Zn70Sn3030
70
199/376-noFor soldering aluminium. Excellent wetting.[38] Good strength.Zn60Sn4040
60
199/341-noFor soldering aluminium. Good wetting.[49]Zn95Sn55
95
382-yes?For soldering aluminium. Excellent wetting.[38]Sn90Au1090
10
217[75]-yesIndalloy 238.Au80Sn2020
80
280-yesAu80, Indalloy 182, Premabraze 800. Good wetting, high strength, low creep, high corrosion resistance, high thermal conductivity, high surface tension, zero wetting angle. Suitable for step soldering. The original flux-less alloy, does not need flux. Used for die attachment and attachment of metal lids to semiconductor packages, e.g. kovar lids to ceramic chip carriers. Coefficient of expansion matching many common materials. Due to zero wetting angle requires pressure to form a void-free joint. Alloy of choice for joining gold-plated and gold-alloy plated surfaces. As some gold dissolves from the surfaces during soldering and moves the composition to non-eutectic state (1% increase of Au content can increase melting point by 30 °C), subsequent desoldering requires higher temperature.[76] Forms a mixture of two brittle intermetallic phases, AuSn and Au5Sn.[77] Brittle. Proper wetting achieved usually by using nickel surfaces with gold layer on top on both sides of the joint. Comprehensively tested through military standard environmental conditioning. Good long-term electrical performance, history of reliability.[29] Low vapor pressure, suitable for vacuum work. Generally used in applications that require a melting temperature over 150°C.[78] Good ductility. Also classified as a braze.Au98Si2
98Si2370/800[12]-
Au98, Indalloy 194. A non-eutectic alloy used for die attachment of silicon dies. Ultrasonic assistance is needed to scrub the chip surface so a eutectic (3.1% Si) is reached at reflow.Au96.8Si3.2
96.8Si3.2370[12] 363[79]-yesAu97, Indalloy 184. [76] AuSi3.2 is a eutectic with melting point of 363 °C. AuSi forms a meniscus at the edge of the chip, unlike AuSn, as AuSi reacts with the chip surface. Forms a composite material structure of submicron silicon plates in soft gold matrix. Tough, slow crack propagation.[44]Au87.5Ge12.5
87.5Ge12.5361 356[12]-yesAu88, Indalloy 183. Used for die attachment of some chips.[13] The high temperature may be detrimental to the chips and limits reworkability.[29]Au82In18
18
82
451/485[12]-noAu82, Indalloy 178. High-temperature, extremely hard, very stiff.In100
99.99
157-pureIn99. Used for die attachment of some chips. More suitable for soldering gold, dissolution rate of gold is 17 times slower than in tin-based solders and up to 20% of gold can be tolerated without significant embrittlement. Good performance at cryogenic temperatures.[80] Wets many surfaces incl. quartz, glass, and many ceramics. Deforms indefinitely under load. Does not become brittle even at low temperatures. Used as a solder in low-temperature physics, will bond to aluminium. Can be used for soldering to thin metal films or glass with an ultrasonic soldering iron.[31]
How do you get the unown r stone in rock aegis cave in Pokemon mystery dungeon explorers time?
In Pokemon Mystery Dungeon: Explorers of Time, Darkness, and Sky, players can obtain the Unown R Stone in Rock Aegis Cave by defeating a certain number of Unown in the dungeon. Keep exploring the dungeon, defeating Unown enemies, and eventually, you'll find the Unown R Stone as a reward for your efforts. Good luck!
Who is the 1st Filipino scientist?
Dr. Leon Ma. Guerrero who was born in 1853 in Manila has been credited as being the first scientist in the Philippines. He graduated from the St. Thomas University in Manila in 1881 as a Pharmacist. He went on to work as a botanist and authored a book titled â??Medicinal Plantsâ?? in 1921.
How is a concave mirrior used in a flashlight?
A concave mirror reflects and concentrates light, making it useful in flashlights to focus and direct the light beam in a specific direction. The concave shape helps to gather and redirect light rays emitted by the bulb, resulting in a more powerful and focused beam of light.
